Datasheet > GQM1885C2A6R2DB01D

GQM1885C2A6R2DB01D

更新时间： 2022-02-26 14:16:40

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
29页	742K
描述
CHIP MONOLITHIC CERAMIC CAPACITOR FOR GENERAL

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中文翻译

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数据手册
替代型号

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GQM1885C2A6R2DB01D 数据手册

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■SPECIFICATIONS AND TEST METHODS

Adhesive Strength of Termination,Vibration Resistance,Temperature Cycle,

Humidity ,Humidity Load,High Temperature Load

・Test substrate

Test method : Deflection

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/03/15: t:0.8mm)

Copper foil thickness : 0.035mm

Thickness : 1.6mm (GRM02/03/15: t:0.8mm)

Copper foil thickness : 0.035mm

Gray colored part of Fig.1: Solder resist

(Coat with heat resistant resin for soldr)

Land

f4.5

Solder resist

Baked electrode or

copper foil

Glass epoxy board

100

Fig.1

(in:mm)

Fig.3

(in:mm)

Dimension (mm)

Type

GRM02

GRM03

GRM15

GRM18

GRM21

GRM31

GRM32

GRM43

GRM55

0.2

0.3

0.4

1.0

1.2

2.2

3.5

4.5

0.56

0.9

1.5

3.0

4.0

5.0

7.0

8.0

0.23

0.3

0.5

1.2

1.65

2.0

2.9

3.7

5.6

GRM02

GRM03

GRM15

GRM18

GRM21

GRM31

GRM32

GRM43

GRM55

0.2

0.3

0.4

1.0

1.2

2.2

3.5

4.5

0.56

0.9

1.5

3.0

4.0

5.0

7.0

8.0

0.23

0.3

0.5

1.2

1.65

2.0

2.9

3.7

5.6

Pressurization

speed

1.0mm/s

Pressurize

R230

Flexure:≦1

Capacitance meter

Fig.2

(in:mm)

JEMCGS-0001S

1 2 3 456 7 8...29

中文翻译

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GQM1885C2A6R2DB01D 替代型号

型号	品牌	替代类型	描述	数据表
GRM1885C2A6R2DA01D	MURATA	类似代替	Chip Multilayer Ceramic Capacitors for General Purpose

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