■SPECIFICATIONS AND TEST METHODS
Specification
No
Item
Test Method
Temperature
Compensating Type
High Dielectric
Constant Type
10
Adhesive Strength
of Termination
No removal of the terminations or other defect should occur.
Solder the capacitor on the test jig (glass epoxy board)shown in
Fig.3 using an eutectic solder. Then apply 10N* force in parallel
with the test jig for 10±1seconds.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*1N(GRM02),2N(GRM03),5N(GRM15,GRM18)
11
Vibration
Resistance
Appearance No defects or abnormalities.
Capacitance Within the specified tolerance.
Solder the capacitor on the test jig (glass epoxy board) in the same
manner and under the same conditions as (10).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 minute. This motion should be
applied for a period of 2 hours in each 3 mutually perpendicular
directions(total of 6 hours).
30pF and over:Q≧1000
[B1,B3,R1,R6,R7,C7,C8,L8]
W.V.:100V :0.025max.(C＜0.068mF)
:0.05max.(C≧0.068mF)
W.V.:50V/25V :0.025max.
W.V.:16V/10V :0.035max.
W.V.:6.3V/4V :0.05max. (C＜3.3mF)
:0.1max.(C≧3.3mF)
Q/D.F.
30pF and beloow:Q≧400+20C
C:Nominal Capacitance(pF)
[R9]
W.V.:50V: 0.05max.
[F1,F5]
W.V.:25Vmin
:0.05max. (C＜0.1mF)
:0.09max. (C≧0.1mF)
W.V.:16V/10V:0.125max.
W.V.:6.3V:0.15max.
12
13
Deflection
Appearance No defects or abnormalities.
Capacitance Within ±5% or± 0.5pF
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig.1 using an eutectic solder. Then apply a force in the direction
shown in Fig 2 for 5±1 seconds. The soldering should be done
by the reflow method and should be conducted with care so that
the soldering is uniform and free of defects such as heat shock.
Within ±10%
Change
(Whichever is larger)
Solderability
75% of the terminations is to be soldered evenly and continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight propotion) .
Preheat at 80 to 120℃ for 10-to 30 seconds.
of Termination
After preheating, immerse in an eutectic solder solution for
2±0.5 seconds at 230±5℃ or Sn-3.0Ag-0.5Cu solder solution
for 2±0.5 seconds at 245±5℃.
Resistance to
Soldering Heat
14
Appearance No defects or abnormalities.
Preheat the capacitor at 120 to 150℃ for 1 minute.
Immerse the capacitor in an eutectic solder solution* or
Sn-3.0Ag-0.5Cu solder solution at 270±5℃ for 10±0.5 seconds.
Set at room temperature for 24±2 hours, then measure.
*Not apply to GRM02
B1,B3,R1,R6,R7,R9,C7,C8,L8:Within ±7.5%
F1,F5 :Within ±20%
Within ±2.5% or± 0.25pF
(Whichever is larger)
Capacitance
Change
30pF and over:Q≧1000
30pF and beloow:Q≧400+20C
［B1,B3,R1,R6,R7,C7,C8,L8］
W.V.:100V :0.025max.(C＜0.068mF)
:0.05max.(C≧0.068mF)
W.V.:50V/25V :0.025max.
W.V.:16V/10V :0.035max.
W.V.:6.3V/4V :0.05max. (C＜3.3mF)
:0.1max.(C≧3.3mF)
Q/D.F.
· Initial measurement for high dielectric constant type
C:Nominal Capacitance(pF)
Perform a heat treatment at 150+0/-10C for one hour and then set
at room temperature for 24±2 hours.
Perform the initial measurement.
[R9]
*Preheating for GRM32/43/55
Table1
W.V.:50V: 0.05max.
[F1,F5]
Step
Temperature
100C to 120C
170C to 200C
Time
1 min.
1 min.
W.V.:25Vmin
1
2
:0.05max. (C＜0.1mF)
:0.09max. (C≧0.1mF)
W.V.:16V/10V:0.125max.
W.V.:6.3V:0.15max.
I.R.
More than 10,000MW or 500W·F(Whichever is smaller)
Dielectric
Strength
No defects.
Temperature
Cycle
15
Appearance No defects or abnormalities.
Fix the capacitor to the supporting jig in the same
manner and under the same conditions as (10).
Perform the five cycles according to the four heat
treatments shown in the following table.
B1,B3,R1,R6,R7,R9,C7,C8,L8:Within ±7.5%
F1,F5 :Within ±20%
Within ±2.5% or± 0.25pF
(Whichever is larger)
Capacitance
Change
30pF and over:Q≧1000
30pF and beloow:Q≧400+20C
［B1,B3,R1,R6,R7,C7,C8,L8］
W.V.:100V :0.025max.(C＜0.068mF)
:0.05max.(C≧0.068mF)
W.V.:50V/25V :0.025max.
W.V.:16V/10V :0.035max.
W.V.:6.3V/4V :0.05max. (C＜3.3mF)
:0.1max.(C≧3.3mF)
Q/D.F.
Set for 24±2 hours at room temperature, then measure.
Step
1
Temp.(C)
Time (min)
30±3
Min.
Operating Temp.+0/-3
C:Nominal Capacitance(pF)
Room Temp
2
3
4
2 to 3
30±3
2 to 3
Max.
Operating Temp.+3/-0
[R9]
ꢀ
Room Temp
W.V.:50V: 0.05max.
[F1,F5]
W.V.:25Vmin
· Initial measurement for high dielectric constant type
:0.05max. (C＜0.1mF)
:0.09max. (C≧0.1mF)
W.V.:16V/10V:0.125max.
W.V.:6.3V:0.15max.
Perform a heat treatment at 150+0/-10C for one hour and then set
at room temperature for 24±2 hours.
Perform the initial measurement.
I.R.
More than 10,000MW or 500W·F(Whichever is smaller)
Dielectric
Strength
No defects.
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