GL34A thru GL34M
SSUURRFFAACCEE MMOOUUNNTT GGLLAASSSS PPAASSSSIIVVAATTEEDD RREECCTTIIFFIIEERRSS
DO-213AA / MINI MELF
SOLDERABLE ENDS
0.066(1.676)
D1=
CATHODE BAND
0.060(1.524)
D2
0.022(0.559)
0.016(0.406)
0.145(3.683)
0.131(3.327)
+0
D2=D1
-0.008(0.20)
Dimension in inches (millimeters)
FEATURES
MECHANICAL DATA
Ldeal for surface mounted applications
Easy pick and place
Case Molded plastic use UL94V-0 recoqnized
flame retardant epoxy
Low leakage current
Terminals Plated terminals, solderable per
MIL-STD-202, Method208
Glass passivated chips
Metallurgically bonded construction
High temperature soldering guaranteed
Polarity Silver Color band on body denotes cathode
Mounting position Any
o
Weight 0.036gram
250 C/10 seconds/.375 , (9.5mm) lead lengths
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
o
Ratings at 25 C ambient temp. unless otherwise specified
Single phase, half sine wave, 60Hz, resistive or inductive load
For capacitive load, derate current by 20%
GL
GL
GL
GL
GL
GL
GL
SYMBOL
UNITS
Volts
34A
34B
34D
34G
34J
34K
34M
Maximum Current Peak Reverse Voltage
Maximum RMS Voltage
VRRM
50
35
50
100
70
200
140
200
400
280
400
0.5
600
420
600
800
560
800
1000
700
Volts
VRMS
Maximum DC Blocking Voltage
Volts
VDC
100
1000
0
Amps
I(AV)
Maximum Average Forward Rectified Current@TT=75 C
Peak Forward Surge Current 8.3ms Single Half
Amps
IFSM
VF
IR
30
1.1
9.0
Sine-Wave Superimposed on Rated Load (JEDEC Method)
Maximum Instantaneous Forward Voltage at 0.5A
Volts
0
Maximum DC Reverse Current @TA=25 C
A
0
at Rated DC Blocking Voltage TA=125 C
pF
Typical Junction Capacitance (Note 1)
Typical Thermal Rseistance (Note 2)
Operating and Storage Temperature Range TJ, TSTG
NOTES
CJ
15
50
0
R
JC
C / W
0
TSTG
-65 to +150
C
1. Measured at 1 MHz and Applied Reverse Voltage of 4.0 Volts D.C
2. Thermal Resestance From Junction to Ambient
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