ISSUED DATE :2004/12/13
REVISED DATE :
GTM
CORPORATION
GDMBD4148
S U R F A C E M O U N T, S W I T C H I N G D I O D E
V O LT AG E 7 5 V, C U R R E N T 0 . 2 A
Description
The GDMBD4148 is designed for high-speed switching application in hybrid thick and thin-film circuits. The devices is manufactured by the
silicon epitaxial planar process and packed in plastic surface mount package.
Package Dimensions
Millimeter
Millimeter
REF.
REF.
Min.
Max.
1.05
0.10
1.00
1.45
1.80
2.70
Min.
Max.
A
A1
A2
D
E
HE
0.85
0
L
b
c
0.20
0.25
0.10
0.40
0.40
0.18
0.80
1.15
1.60
2.30
Q1
0.15 BSC.
Absolute Maximum Ratings at Ta = 25к
Parameter
Symbol
Tj
Ratings
+150
-65 ~ +150
100
Unit
ć
Junction Temperature
ć
Storage Temperature
Tstg
VRM
VR
Maximum Peak Reverse Voltage
Maximum Reverse Voltage
V
75
V
IO
Average Forward Current
200
mA
A
IFSM
CJ
Surge Current(1us)
2
Typical Junction Capacitance between Terminal (Note 1)
Maximum Reverse Recovery Time (Note2)
Total Power Dissipation
4.0
pF
TRR
PD
4.0
nSec
mW
225
Electrical Characteristics at Ta = 25к
Characteristic
Symbol
Min.
Max.
Unit
V
Test Conditions
Forward Voltage
VF
-
100
-
1
-
IF=10mA
IR=100uA
VR=75V
Reverse Breakdown
Reverse Current
VR
V
IR
5
uA
Notes: 1. Measured at 1.0 MHz and applied reverse voltage of 0 volt.
2. Measured at applied forward current of 10mA, reverse current of 1.0mA, Reverse voltage of 6.0volt and RL=100 ̂˻̀̆.
3. ESD sensitive product handling required.
GDMBD4148
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