Datasheet > GD80960JF33

GD80960JF33

更新时间： 2024-01-05 12:35:04

品牌	Logo	应用领域
英特尔 - INTEL		时钟外围集成电路
页数	文件大小	规格书
90页	1261K
描述
RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA196, PLASTIC, BGA-196

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GD80960JF33 技术参数

生命周期：	Obsolete	零件包装代码：	BGA
包装说明：	BGA, BGA196(UNSPEC)	针数：	196
Reach Compliance Code：	unknown	ECCN代码：	3A991.A.2
HTS代码：	8542.31.00.01	风险等级：	5.77
地址总线宽度：	32	位大小：	32
边界扫描：	YES	最大时钟频率：	33.3 MHz
外部数据总线宽度：	32	格式：	FIXED POINT
集成缓存：	YES	JESD-30 代码：	S-PBGA-B196
低功率模式：	YES	端子数量：	196
封装主体材料：	PLASTIC/EPOXY	封装代码：	BGA
封装等效代码：	BGA196(UNSPEC)	封装形状：	SQUARE
封装形式：	GRID ARRAY	电源：	3.3,3.3/5 V
认证状态：	Not Qualified	速度：	33 MHz
子类别：	Microprocessors	最大压摆率：	320 mA
最大供电电压：	3.45 V	最小供电电压：	3.15 V
标称供电电压：	3.3 V	表面贴装：	YES
技术：	CMOS	端子形式：	BALL
端子位置：	BOTTOM	uPs/uCs/外围集成电路类型：	MICROPROCESSOR, RISC
Base Number Matches：	1

GD80960JF33 数据手册

Contents

42 Boundary-Scan Register—Bit Order ..........................................................................................81

43 Natural Boundaries for Load and Store Accesses......................................................................81

44 Summary of Byte Load and Store Accesses ..............................................................................82

45 Summary of Short Word Load and Store Accesses...................................................................82

46 Summary of n-Word Load and Store Accesses (n = 1, 2, 3, 4)..................................................83

Revision History

Date

Revision

Description

To address the fact that many of the package prefix variables have

changed, all package prefix variables in this document are now

indicated with an "x".

August 2004

006

Removed reference to A80960JF-16 from Table 3 on page 15.

Removed reference to NG80960JC-40, NG80960JC-33, NG80960JS-16,

and NG80960JF-16 from Table 4 on page 15.

Removed reference to GD80960JC-40, GD80960JC-33, and 80960JS-16

in Table 6 on page 16.

September 2002

005

Removed reference to 80960JC-40, 80960JC-33, 80960JS-16, and

80960JF-16 in Table 18 on page 35.

Removed reference to 80960JC-40, 80960JC-33, 80960JS-16, and

80960JF-16 from Table 21 on page 39.

Removed reference to 80960JC-40, 80960JC-33, 80960JS-16 and

80960JF-16 from Table 22 on page 42.

Added new extended temp device offerings. See Table 5 on page 16.

Removed PGA package availability from JS/JC/JT processors.

September 1999

June 1999

004

003

Changed AC timing parameter T_OV1(min) for extended temp devices only.

See Table 22 on page 42.

Merged the 80960JS/JC datasheet information into this datasheet

(previously named 80960JA/JF/JD/JT 3.3 V Embedded 32-Bit

Microprocessor datasheet).

Updated I_CCvalues for the 80960JS/JC/JT processors. Increased

TIH1 specificationfor the 80960JS/JC/JT processors. Updated

MPBGA thermal specifications.

Corrected orientation of MPBGA package diagrams (Figure 6 on page 30

and Figure 7 on page 31).

December 1998

002

001

Added Figure 11 on page 46, Figure 12 on page 46, Figure 14 on page 47,

and Figure 15 on page 48 to distinguish 80960JT 3.3-V and 5-V signal

derating curves from the 80960JA/JF/JD derating curves.

This datasheet supersedes revisions to the following 80960Jx datasheets:

#273109 (JT), #272971-002 (JD), and #276146-001 (JA/JF). In addition to

combining the documents into one, the following content was changed:

Figure 1 on page 7: Added MPBGA package to diagram.

March 1998

Section 3.2.4, “80960Jx 196-Ball MPBGA Pinout” on page 30: Added new

Figures 6 and 7, Tables 10, 11 and 13.

Figure 16 on page 48: Added with the note that follows the figure.

Datasheet

1...3 4 567 8 9...90

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与GD80960JF33相关器件

型号	品牌	描述	获取价格	数据表
GD80960JF-33	INTEL	EMBEDDED 32-BIT MICROPROCESSOR	获取价格
GD80960JS-25	INTEL	RISC Microprocessor, 32-Bit, 25MHz, CMOS, PBGA196, PLASTIC, BGA-196	获取价格
GD80960JS-33	INTEL	RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA196, PLASTIC, BGA-196	获取价格
GD80960JT-100	INTEL	EMBEDDED 32-BIT MICROPROCESSOR	获取价格
GD80960JT-75	INTEL	EMBEDDED 32-BIT MICROPROCESSOR	获取价格
GD80TLQ120F1S	STARPOWER	F1.2-Advanced Trench FS Fast IGBT	获取价格

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