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GD80960JF33 PDF预览

GD80960JF33

更新时间: 2024-01-08 20:11:26
品牌 Logo 应用领域
英特尔 - INTEL 时钟外围集成电路
页数 文件大小 规格书
90页 1261K
描述
RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA196, PLASTIC, BGA-196

GD80960JF33 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:BGA, BGA196(UNSPEC)针数:196
Reach Compliance Code:unknownECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.77
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:33.3 MHz
外部数据总线宽度:32格式:FIXED POINT
集成缓存:YESJESD-30 代码:S-PBGA-B196
低功率模式:YES端子数量:196
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA196(UNSPEC)封装形状:SQUARE
封装形式:GRID ARRAY电源:3.3,3.3/5 V
认证状态:Not Qualified速度:33 MHz
子类别:Microprocessors最大压摆率:320 mA
最大供电电压:3.45 V最小供电电压:3.15 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS端子形式:BALL
端子位置:BOTTOMuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

GD80960JF33 数据手册

 浏览型号GD80960JF33的Datasheet PDF文件第1页浏览型号GD80960JF33的Datasheet PDF文件第2页浏览型号GD80960JF33的Datasheet PDF文件第4页浏览型号GD80960JF33的Datasheet PDF文件第5页浏览型号GD80960JF33的Datasheet PDF文件第6页浏览型号GD80960JF33的Datasheet PDF文件第7页 
Contents  
Contents  
1.0 Introduction....................................................................................................................................  
2.0 80960Jx Overview..........................................................................................................................  
7
9
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
80960 Processor Core........................................................................................................10  
Burst Bus ............................................................................................................................11  
Timer Unit ...........................................................................................................................11  
Priority Interrupt Controller..................................................................................................11  
Instruction Set Summary ....................................................................................................12  
Faults and Debugging.........................................................................................................12  
Low Power Operation .........................................................................................................12  
Test Features......................................................................................................................12  
Memory-Mapped Control Registers....................................................................................13  
2.10 Data Types and Memory Addressing Modes......................................................................13  
3.0 Pac aging Information................................................................................................................15  
k
3.1  
3.2  
Available Processors and Packages ..................................................................................15  
Pin Descriptions..................................................................................................................16  
3.2.1 Functional Pin Definitions ......................................................................................16  
3.2.2 80960Jx 132-Lead PGA Pinout .............................................................................23  
3.2.3 80960Jx 132-Lead PQFP Pinout ...........................................................................27  
3.2.4 80960Jx 196-Ball MPBGA Pinout..........................................................................30  
4.0 Electrical Specifications .............................................................................................................35  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
Absolute Maximum Ratings................................................................................................35  
Operating Conditions..........................................................................................................35  
Connection Recommendations...........................................................................................36  
VCC5 Pin Requirements (VDIFF).......................................................................................36  
VCCPLL Pin Requirements ................................................................................................37  
D.C. Specifications .............................................................................................................38  
A.C. Specifications..............................................................................................................42  
4.7.1 A.C. Test Conditions and Derating Curves............................................................45  
4.7.1.1 Output Delay or Hold vs. Load Capacitance..........................................46  
4.7.1.2  
T
vs. AD Bus Load Capacitance.........................................................47  
LX  
4.7.1.3 ICC Active vs. Frequency ......................................................................49  
4.7.2 A.C. Timing Waveforms.........................................................................................53  
5.0 Device Identification....................................................................................................................59  
5.1  
5.2  
5.3  
80960JS/JC/JT Device Identification Register....................................................................60  
80960JD Device Identification Register..............................................................................61  
80960JA/JF Device Identification Register.........................................................................62  
6.0 Thermal Specifications ...............................................................................................................63  
6.1  
Thermal Management Accessories ....................................................................................68  
6.1.1 Heatsinks ...............................................................................................................68  
7.0 Bus Functional Waveforms ........................................................................................................69  
7.1  
7.2  
Basic Bus States.................................................................................................................79  
Boundary-Scan Register.....................................................................................................80  
Datasheet  
3

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