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GD80960JF33 PDF预览

GD80960JF33

更新时间: 2024-02-10 23:43:00
品牌 Logo 应用领域
英特尔 - INTEL 时钟外围集成电路
页数 文件大小 规格书
90页 1261K
描述
RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA196, PLASTIC, BGA-196

GD80960JF33 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:BGA, BGA196(UNSPEC)针数:196
Reach Compliance Code:unknownECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.77
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:33.3 MHz
外部数据总线宽度:32格式:FIXED POINT
集成缓存:YESJESD-30 代码:S-PBGA-B196
低功率模式:YES端子数量:196
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA196(UNSPEC)封装形状:SQUARE
封装形式:GRID ARRAY电源:3.3,3.3/5 V
认证状态:Not Qualified速度:33 MHz
子类别:Microprocessors最大压摆率:320 mA
最大供电电压:3.45 V最小供电电压:3.15 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS端子形式:BALL
端子位置:BOTTOMuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

GD80960JF33 数据手册

 浏览型号GD80960JF33的Datasheet PDF文件第1页浏览型号GD80960JF33的Datasheet PDF文件第2页浏览型号GD80960JF33的Datasheet PDF文件第3页浏览型号GD80960JF33的Datasheet PDF文件第5页浏览型号GD80960JF33的Datasheet PDF文件第6页浏览型号GD80960JF33的Datasheet PDF文件第7页 
Contents  
Figures  
1
2
3
4
5
6
7
8
9
80960Jx Microprocessor Package Options..................................................................................  
7
80960Jx Block Diagram..............................................................................................................10  
132-Lead Pin Grid Array Top View-Pins Facing Down...............................................................23  
132-Lead Pin Grid Array Bottom View-Pins Facing Up..............................................................24  
132-Lead PQFP - Top View .......................................................................................................27  
196-Ball Mini Plastic Ball Grid Array Top View-Balls Facing Down............................................30  
196-Ball Mini Plastic Ball Grid Array Bottom View-Balls Facing Up ...........................................31  
VCC5 Current-Limiting Resistor .................................................................................................36  
VCCPLL Lowpass Filter .............................................................................................................37  
10 A.C. Test Load............................................................................................................................45  
11 Output Delay or Hold vs. Load Capacitance–80960JS/JC/JT (3.3 V Signals) ..........................46  
12 Output Delay or Hold vs. Load Capacitance–80960JS/JC/JT (5 V Signals) .............................46  
13 Output Delay or Hold vs. Load Capacitance–80960JA/JF/JD....................................................47  
14  
15  
16  
17  
T
T
T
vs. AD Bus Load Capacitance–80960JS/JC/JT (3.3 V Signals) .........................................47  
vs. AD Bus Load Capacitance–80960JS/JC/JT (5 V Signals) ............................................48  
vs. AD Bus Load Capacitance–80960JA/JF/JD...................................................................48  
Active (Power Supply) vs. Frequency–80960JA/JF .............................................................49  
LX  
LX  
LX  
I
CC  
18 80960JA/JF I Active (Thermal) vs. Frequency .......................................................................49  
CC  
19 80960JD I Active (Power Supply) vs. Frequency...................................................................50  
CC  
20 80960JD I Active (Thermal) vs. Frequency ............................................................................50  
CC  
21 80960JC I Active (Power Supply) vs. Frequency...................................................................51  
CC  
22 80960JC I Active (Thermal) vs. Frequency ............................................................................51  
CC  
23 80960JS I Active (Power Supply) vs. Frequency...................................................................52  
CC  
24 80960JS I Active (Thermal) vs. Frequency............................................................................52  
CC  
25 CLKIN Waveform........................................................................................................................53  
26  
27  
28  
29  
30  
31  
32  
T
T
T
T
T
T
T
Output Delay Waveform ....................................................................................................53  
Output Float Waveform .......................................................................................................54  
OV1  
OF  
IS1  
IS2  
IS3  
IS4  
and T  
and T  
and T  
and T  
Input Setup and Hold Waveform ..........................................................................54  
Input Setup and Hold Waveform ..........................................................................54  
Input Setup and Hold Waveform ..........................................................................55  
Input Setup and Hold Waveform ..........................................................................55  
IH1  
IH2  
IH3  
IH4  
, T  
and T  
Relative Timings Waveform........................................................................56  
LX LXL  
LXA  
33 DT/R# and DEN# Timings Waveform.........................................................................................56  
34 TCK Waveform...........................................................................................................................57  
35  
36  
37  
38  
T
T
T
T
and T  
Input Setup and Hold Waveforms.................................................................57  
BSIS1  
BSIH1  
and T  
and T  
Output Delay and Output Float Waveform.................................................57  
Output Delay and Output Float Waveform.................................................58  
BSOV1  
BSOV2  
BSOF1  
BSOF2  
and T  
Input Setup and Hold Waveform...................................................................58  
BSIS2  
BSIH2  
39 80960JS/JC/JT Device Identification Register Fields.................................................................60  
40 80960JD Device Identification Register Fields ...........................................................................61  
41 80960JA/JF Device Identification Register Fields ......................................................................62  
42 Non-Burst Read and Write Transactions Without Wait States, 32-Bit Bus.................................69  
43 Burst Read and Write Transactions Without Wait States, 32-Bit Bus ........................................70  
44 Burst Write Transactions With 2,1,1,1 Wait States, 32-Bit Bus..................................................71  
45 Burst Read and Write Transactions Without Wait States, 8-Bit Bus ..........................................72  
46 Burst Read and Write Transactions With 1, 0 Wait States  
and Extra Tr State on Read, 16-Bit Bus .....................................................................................73  
47 Double Word Read Bus Request, Misaligned One Byte From  
Quad Word Boundary, 32-Bit Bus, Little Endian ........................................................................74  
4
Datasheet  

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