GD100FFY120C5S
IGBT Module
Diode Characteristics TC=25oC unless otherwise noted
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
IF=100A,VGE=0V,Tj=25oC
IF=100A,VGE=0V,Tj=125oC
IF=100A,VGE=0V,Tj=150oC
1.70 2.15
Diode Forward
Voltage
VF
1.65
1.65
9.0
V
Qr
Recovered Charge
Peak Reverse
Recovery Current -di/dt=2800A/μs,VGE=-15V
Reverse Recovery
Energy
Recovered Charge
Peak Reverse
Recovery Current -di/dt=2800A/μs,VGE=-15V
Reverse Recovery
Energy
Recovered Charge
Peak Reverse
Recovery Current -di/dt=2800A/μs,VGE=-15V
Reverse Recovery
Energy
μC
VR=600V,IF=100A,
IRM
110
A
Tj=25oC
Erec
Qr
3.32
16.2
120
mJ
μC
A
VR=600V,IF=100A,
IRM
Tj=125oC
Erec
Qr
5.70
19.5
123
mJ
μC
A
VR=600V,IF=100A,
IRM
Tj=150oC
Erec
7.13
mJ
NTC Characteristics TC=25oC unless otherwise noted
Symbol
R25
∆R/R
P25
Parameter
Test Conditions
Min. Typ. Max. Unit
Rated Resistance
5.0
kΩ
%
Deviation of R100 TC=100oC,R100=493.3Ω
-5
5
Power Dissipation
20.0
mW
R2=R25exp[B25/50(1/T2-
1/(298.15K))]
R2=R25exp[B25/80(1/T2-
1/(298.15K))]
R2=R25exp[B25/100(1/T2-
1/(298.15K))]
B25/50
B25/80
B25/100
B-value
3375
3411
3433
K
K
K
B-value
B-value
Module Characteristics TC=25oC unless otherwise noted
Symbol
LCE
RCC’+EE’
Parameter
Min.
Typ.
19
1.80
Max.
Unit
nH
mΩ
Stray Inductance
Module Lead Resistance, Terminal to Chip
Junction-to-Case (per IGBT)
Junction-to-Case (per Diode)
Case-to-Heatsink (per IGBT)
Case-to-Heatsink (per Diode)
Case-to-Heatsink (per Module)
Mounting Torque, Screw M5
Weight of Module
0.293
0.505
RthJC
K/W
0.190
0.327
0.020
RthCH
K/W
M
G
3.0
6.0
N.m
g
200
©2017 STARPOWER Semiconductor Ltd.
12/6/2017
4/9
SN0D