Datasheet > GBJ2002

GBJ2002

更新时间： 2024-11-12 10:40:35

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SECOS		/
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描述
Voltage 50V ~ 1000V 20.0 Amp Glass Passivited Bridge Rectifiers

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数据手册

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GBJ2002 数据手册

GBJ20005 ~ GBJ2010

Voltage 50V ~ 1000V

20.0 Amp Glass Passivited Bridge Rectifiers

Elektronische Bauelemente

RoHS Compliant Product

A suffix of “-C” specifies halogen & lead-free

GBJ

FEATURES

ꢀ

Rating to 1000V PRV

Ideal for printed circuit board

Low forward voltage drop, high current capability

Reliable low cost construction utilizing molded plastic

technique results in inexpensive product

ꢀ

The plastic material has Underwriters Laboratory

flammability classification 94V-0

Millimeter

Min. Max.

REF.

Min.

Max.

30.3

20.3

4.8

29.7

19.7

4.4

0.6

7.3

2.0

9.8

0.8

7.7

2.4

17.0

18.0

10.2

3.0 x 45°

2.3

3.6

2.7

4.2

3.1

3.4

5.1

2.9

1.1

10.8

3.1

11.2

3.4

2.5

0.9

3.4

3.8

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

(Rating 25°C ambient temperature unless otherwise specified. Single phase half wave, 60Hz, resistive or inductive load.

For capacitive load, de-rate current by 20%.)

Part Number

Parameter

Symbol

Unit

GBJ

20005

GBJ

2001

GBJ

2002

GBJ

2004

GBJ

2006

GBJ

2008

GBJ

2010

1000

700

V_RRM

V_RMS

V_DC

100

200

140

200

400

280

400

600

420

600

800

560

800

Maximum Recurrent Peak Reverse Voltage

Maximum RMS Bridge Input Voltage

100

1000

Maximum DC Blocking Voltage

Maximum Average Forward (with heat sink) ²

I_(AV)

Rectified Current @T_C=100°C (without heat sink)

3.6

Peak Forward Surge Current 8.3 ms Single Half

Sine-Wave Super Imposed on Rated Load

(JEDEC Method)

I_FSM

V_F

I_R

260

Maximum Forward Voltage @ 10A DC

1.1

T_J=25°C

Maximum DC Reverse Current

µA

at Rated DC Blocking Voltage

T_J=125°C

500

I²t Rating for Fusing (t<8.3ms)

I²t

240

A²s

Typical Junction Capacitance Per Element ¹

C_J

Typical Thermal Resistance

θJC

0.8

°C/W

°C

Operating and Storage temperature range

T_J,T_STG

-55~150

Notes：

1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.

2. Device mounted on 300mm*300mm*1.6mm Cu plate heat sink.

http://www.SeCoSGmbH.com/

Any changes of specification will not be informed individually.

19-Oct-2011 Rev. A

Page 1 of 2

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