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GA300TD60U PDF预览

GA300TD60U

更新时间: 2024-11-12 22:29:43
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率控制瞄准线双极性晶体管局域网
页数 文件大小 规格书
10页 242K
描述
HALF-BRIDGE IGBT DUAL INT-A-PAK

GA300TD60U 数据手册

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PD -50057E  
GA300TD60U  
TM  
Ultra-Fast Speed IGBT  
"HALF-BRIDGE" IGBT DUAL INT-A-PAK  
Features  
VCES = 600V  
• Generation 4 IGBT technology  
• UltraFast: Optimized for high operating  
frequencies 8-40 kHz in hard switching, >200  
kHz in resonant mode  
VCE(on) typ. = 1.80V  
• Very low conduction and switching losses  
• HEXFREDantiparallel diodes with ultra- soft  
recovery  
@V = 15V, IC = 300A  
GE  
• Industry standard package  
• UL approved  
Benefits  
• Increased operating efficiency  
• Direct mounting to heatsink  
• Performance optimized for power conversion: UPS,  
SMPS, Welding  
• Lower EMI, requires less snubbing  
Absolute Maximum Ratings  
Parameter  
Collector-to-Emitter Voltage  
Max.  
600  
300  
600  
600  
600  
±20  
2500  
880  
Units  
V
VCES  
IC @ TC = 25°C  
Continuous Collector Current  
Pulsed Collector Current•  
ICM  
A
ILM  
Peak Switching Current‚  
IFM  
Peak Diode Forward Current  
Gate-to-Emitter Voltage  
VGE  
V
VISOL  
RMS Isolation Voltage, Any Terminal To Case, t = 1 min  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature Range  
Storage Temperature Range  
PD @ TC = 25°C  
W
PD @ TC = 85°C  
460  
TJ  
-40 to +150  
-40 to +125  
°C  
TSTG  
Thermal / Mechanical Characteristics  
Parameter  
Thermal Resistance, Junction-to-Case - IGBT  
Typ.  
Max.  
0.14  
0.20  
Units  
RθJC  
RθJC  
RθCS  
Thermal Resistance, Junction-to-Case - Diode  
Thermal Resistance, Case-to-Sink - Module  
Mounting Torque, Case-to-Heatsink ƒ  
Mounting Torque, Case-to-Terminal 1, 2 & 3ƒ  
Weight of Module  
°C/W  
0.1  
.
6.0  
N m  
5.0  
400  
g
www.irf.com  
1
05/14/02  

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