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FX4C-60P-1.27DSA(71) PDF预览

FX4C-60P-1.27DSA(71)

更新时间: 2024-10-14 14:33:39
品牌 Logo 应用领域
广濑 - HRS PC连接器
页数 文件大小 规格书
9页 235K
描述
Board Stacking Connector, 60 Contact(s), 2 Row(s), Male, Straight, 0.05 inch Pitch, Solder Terminal, Locking, Beige Insulator, ROHS COMPLIANT

FX4C-60P-1.27DSA(71) 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:ROHS COMPLIANTReach Compliance Code:unknown
风险等级:5.74连接器类型:BOARD STACKING CONNECTOR
联系完成配合:GOLD联系完成终止:GOLD
触点性别:MALE触点材料:PHOSPHOR BRONZE
触点模式:RECTANGULAR触点电阻:45 m Ω
DIN 符合性:NO介电耐压:300VAC V
耐用性:300 Cycles滤波功能:NO
IEC 符合性:NO绝缘电阻:100000000 Ω
绝缘体颜色:BEIGE绝缘体材料:POLYAMIDE
JESD-609代码:e4MIL 符合性:NO
插接触点节距:0.05 inch插接信息:MULTIPLE MATING PARTS AVAILABLE
混合触点:NO安装选项1:LOCKING
安装方式:STRAIGHT安装类型:BOARD
连接器数:ONEPCB行数:4
装载的行数:2最高工作温度:85 °C
最低工作温度:-55 °C选件:GENERAL PURPOSE
PCB接触模式:STAGGEREDPCB触点行间距:1.27 mm
极化密钥:POLARIZED HOUSING额定电流(信号):0.5 A
参考标准:UL可靠性:COMMERCIAL
子类别:Headers and Edge Type Connectors端子长度:0.13 inch
端子节距:1.27 mm端接类型:SOLDER
触点总数:60UL 易燃性代码:94V-0
Base Number Matches:1

FX4C-60P-1.27DSA(71) 数据手册

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The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
Stacking Height 5 to 11mm Half Pitch Connector  
FX4 Series  
Stacking Height Flexible  
5 to 11mm  
DIP type  
The mounting area 70% reduced, compared with  
conventional product (FX2 series)  
FX2 series  
FX4 series  
(Compared with 60 contacts)  
Features  
The FX4 series is a miniature board to board connectors, where the stacking height can be set at the 1mm interval.  
Through hole Type  
1. Small and Light  
The mounting space and weight is reduced about 30%, compared to the conventional product (HRS FX2 series),  
respectively, and the mounting area about 70% reduced, compared to the conventional one.  
2. Stacking Height 5 to 11mm  
The board to board stacking height can be set per 1mm from 5mm up to 11mm.  
3. Flux Swell Prevention  
When solder is dipped, the flux swell from the board rear side is completely prevented.  
4. Mis-insertion Prevention and Low Insertion/Extraction Force Mechanism  
The connection area is designed to completely prevent the mis-insertion.  
Moreover, the low insertion/extraction mechanism is adopted.  
Applications  
Computers, peripheral equipments, business equipments, etc.  
A119  

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