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FX4C-80S-1.27DSA PDF预览

FX4C-80S-1.27DSA

更新时间： 2024-11-19 23:14:51
品牌 Logo 应用领域
广濑 - HRS 连接器
页数 文件大小 规格书
17页 476K
描述
Stacking Height 5 to 11mm Half Pitch Connector

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中文翻译

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FX4C-80S-1.27DSA 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
Reach Compliance Code：unknown风险等级：5.83
其他特性：POLARIZED主体宽度：0.197 inch
主体深度：0.157 inch主体长度：2.361 inch
主体/外壳类型：RECEPTACLE连接器类型：BOARD STACKING CONNECTOR
联系完成配合：GOLD联系完成终止：GOLD
触点性别：FEMALE触点材料：PHOSPHOR BRONZE
触点模式：RECTANGULAR触点电阻：45 m Ω
触点样式：BELLOWED TYPEDIN 符合性：NO
介电耐压：300VAC V耐用性：300 Cycles
滤波功能：NOIEC 符合性：NO
最大插入力：LIF N绝缘电阻：100000000 Ω
绝缘体颜色：BEIGE绝缘体材料：POLYAMIDE
JESD-609代码：e4MIL 符合性：NO
插接触点节距：0.05 inch插接信息：MULTIPLE MATING PARTS AVAILABLE
混合触点：NO安装方式：STRAIGHT
安装类型：BOARD连接器数：ONE
PCB行数：4装载的行数：2
最高工作温度：85 °C最低工作温度：-55 °C
选件：GENERAL PURPOSEPCB接触模式：STAGGERED
PCB触点行间距：1.27 mm极化密钥：ENDS
额定电流（信号）：0.5 A参考标准：UL
可靠性：COMMERCIAL子类别：Headers and Edge Type Connectors
端子长度：0.13 inch端子节距：2.54 mm
端接类型：SOLDER触点总数：80
UL 易燃性代码：94V-0撤离力-最小值：LIF N

FX4C-80S-1.27DSA 数据手册

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Stacking Height 5 to 11mm Half Pitch Connector  
FX4 Series  
Stacking Height Flexible  
5 to 11mm  
6 to 11mm  
SMT type  
DIP type  
The mounting area 70% reduced, compared with  
conventional product (FX2 series)  
FX2 series  
FX4 series  
(Compared with 60 contacts)  
ꢀFeatures  
The FX4 series is a miniature board to board connectors, where the stacking height can be set at the 1mm interval.  
According to the mounting method, you can select the product from the through hole type and SMT type.  
ꢀThrough hole Type  
ꢀSMT Type  
1. Small and Light  
1. Small and Light  
The mounting space and weight is reduced about 30%,  
compared to the conventional product (HRS FX2 series),  
respectively, and the mounting area about 70% reduced,  
compared to the conventional one.  
The mounting space and weight is reduced about 40%,  
compared with the conventional product (HRS FX2 series),  
and the mounting area is reduced 80%, compared to the  
conventional one.  
2. Stacking Height 5 to 11mm  
2. Stacking Height 6 to 11mm  
The board to board stacking height can be set per 1mm  
from 5mm up to 11mm.  
The board to board stacking height can be set per 1mm  
from 6mm up to 11mm. In addition, the height can be also  
set in combination with the through hole type.  
3. Flux Swell Prevention  
3. Mis-insertion Prevention and Low  
Insertion/Extraction Structure  
When solder is dipped, the flux swell from the board rear  
side is completely prevented.  
The connection area is designed to completely prevent the  
mis-insertion.  
4. Mis-insertion Prevention and Low  
Insertion/Extraction Force Mechanism  
Moreover, the low insertion/extraction force mechanism is  
adopted.  
The connection area is designed to completely prevent the  
mis-insertion.  
4. Positioning Boss Selectable  
Moreover, the low insertion/extraction mechanism is  
adopted.  
According to the mounting condition, it is selected whether  
or not the boss is required. Regarding the boss attached  
type, the boss eccentric position can stabilize the mounting  
direction.  
ꢀApplications  
Computers, peripheral equipments, business equipments, etc.  
A189  
1234567...17

中文翻译

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