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FX11LA-120S/12-SV(91) PDF预览

FX11LA-120S/12-SV(91)

更新时间： 2024-10-14 20:59:19
品牌 Logo 应用领域
广濑 - HRS PC连接器
页数 文件大小 规格书
16页 693K
描述
Board Connector, 120 Contact(s), 2 Row(s), Straight, 0.02 inch Pitch, Surface Mount Terminal, Locking, Beige Insulator, Receptacle

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FX11LA-120S/12-SV(91) 技术参数

是否Rohs认证： 符合生命周期：Active
Reach Compliance Code：unknown风险等级：2.28
板上安装选件：PEG主体宽度：0.244 inch
主体深度：0.089 inch主体长度：1.69 inch
主体/外壳类型：RECEPTACLE连接器类型：BOARD CONNECTOR
联系完成配合：AU触点材料：PHOSPHOR BRONZE
触点模式：RECTANGULAR触点电阻：70 m Ω
触点样式：BELLOWED TYPE耐用性：50 Cycles
绝缘电阻：100000000 Ω绝缘体颜色：BEIGE
绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)插接触点节距：0.02 inch
安装选项1：LOCKING安装方式：STRAIGHT
安装类型：BOARD连接器数：ONE
PCB行数：2装载的行数：2
最高工作温度：85 °C最低工作温度：-55 °C
PCB接触模式：RECTANGULARPCB触点行间距：5.6896 mm
电镀厚度：4u inch极化密钥：POLARIZED HOUSING
额定电流（信号）：0.3 A参考标准：UL
可靠性：COMMERCIAL子类别：Headers and Edge Type Connectors
端子节距：0.508 mm端接类型：SURFACE MOUNT
触点总数：120Base Number Matches：1

FX11LA-120S/12-SV(91) 数据手册

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0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm  
High-Speed Board-to-Board Connections  
FX11 Series  
Stacking height : 2mm  
Stacking height : 2.5mm, 3mm  
10 Signal : 1 Ground Arrangement  
■Features  
1. Low Profile Design  
The board-to-board mating height of 2mm, 2.5mm and 3mm suits  
smaller, thinner case designs. (Fig.2)  
2. Improved Transmission Efficiency Between Boards  
Transmission characteristics have been improved through a design  
that fixes ground plates to both sides of the header and receptacle.  
Ground Plate  
Signal contact  
Housing  
3. 10 Signal:1 Ground Arrangement  
Metal fitting  
Signal and ground are arranged in a ratio of 10 : 1 with the ground plate connected to  
the board Via SMT. The ground stability achieved serves to reduce noise. (Fig.1)  
Ground plate and metal fitting make contact  
Fig.1  
4. Metal Fittings for Added Strength  
Stacking Height Variation  
Metal fittings provide for greater adhesion to the board, which  
protects the connector against sheaning forces. The unique  
connector design provides a connection between the fitting and the  
ground plate for a stronger ground  
.
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5. Suited to High-Density Applications  
The signal contact pitch of 0.5mm affords a compact connector,  
and reduces mounting space on the board.  
Note: 2.0mm type product cannot be used or interchanged  
with the 2.5mm or 3.0mm type product.  
Fig.2  
6. Structure Prevents Solder Wicking  
A solder gap has been designed into the contact SMT portion to  
prevent solder wicking. (Fig.3)  
Structure Prevent Solder Wicking  
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7. High Contact Reliability  
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Effective wipe length is 0.55mm (2mm height) and 1mm(2.5mm,  
3mm height) for signal contacts.  
8. Optional Ground Plate  
Fig.3  
An alternate style is also available without the ground plate. The  
space provided by the absence of the ground plate is filled with  
additional signal contacts.  
■Signal Integrity Features  
●Insertion-Loss-to-Crosstalk Ratio (ICR)  
Impedance 3mm(Without GND)  
120  
The insertion-loss-to-crosstalk  
ratio (ICR) with five differential  
FEXT aggressors meets the  
extrapolated IEEE802.3ap  
ICR 3mm(Without GND)  
60  
50  
115  
110  
105  
100  
95  
+
40  
30  
20  
specification to 10 Gbps.  
●Differential Impedance  
90  
The differential impedance is  
10  
0
+
100 /- 10ø for FX11 at 50 ps  
85  
80  
ICR  
FX11- 3mm DifferentialTDR  
IEEEspec  
rise time(20% to 80%).  
0
1
2
3
4
5
6
7
8
9
10  
0.8  
0.9  
1
1.1  
1.2  
1.3  
1.4  
1.5  
Time(ns)  
Frequency(GHz)  
In cases where the application will demand a high level of reliability, such as automotive,  
please contact a company representative for further information.  
1
2017.11e  
1234567...16

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