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FS32K112BWTXVLHTR PDF预览

FS32K112BWTXVLHTR

更新时间: 2024-11-03 01:55:15
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
100页 1594K
描述
Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency

FS32K112BWTXVLHTR 数据手册

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Document Number S32K1XX  
Rev. 12, 02/2020  
NXP Semiconductors  
Data Sheet: Technical Data  
S32K1XX  
S32K1xx Data Sheet  
Notes  
• Power management  
– Low-power Arm Cortex-M4F/M0+ core with  
excellent energy efficiency  
• Supports S32K116, S32K118, S32K142, S32K142W,  
S32K144, S32K144W, S32K146, and S32K148  
– Technical information for S32K142W and  
S32K144W device families is preliminary until  
these devices achieve qualification  
– Power Management Controller (PMC) with multiple  
power modes: HSRUN, RUN, STOP, VLPR, and  
VLPS. Note: CSEc (Security) or EEPROM writes/  
erase will trigger error flags in HSRUN mode (112  
MHz) because this use case is not allowed to  
execute simultaneously. The device will need to  
switch to RUN mode (80 MHz) to execute CSEc  
(Security) or EEPROM writes/erase.  
• The following two attachments are available with the  
Datasheet:  
– S32K1xx_Orderable_Part_Number_ List.xlsx  
– S32K1xx_Power_Modes_Configuration.xlsx  
– Clock gating and low power operation supported on  
specific peripherals.  
Key Features  
• Operating characteristics  
• Memory and memory interfaces  
– Voltage range: 2.7 V to 5.5 V  
– Up to 2 MB program flash memory with ECC  
– 64 KB FlexNVM for data flash memory with ECC  
and EEPROM emulation. Note: CSEc (Security) or  
EEPROM writes/erase will trigger error flags in  
HSRUN mode (112 MHz) because this use case is  
not allowed to execute simultaneously. The device  
will need to switch to RUN mode (80 MHz) to  
execute CSEc (Security) or EEPROM writes/erase.  
– Up to 256 KB SRAM with ECC  
– Ambient temperature range: -40 °C to 105 °C for  
HSRUN mode, -40 °C to 150 °C for RUN mode  
• Arm™ Cortex-M4F/M0+ core, 32-bit CPU  
– Supports up to 112 MHz frequency (HSRUN mode)  
with 1.25 Dhrystone MIPS per MHz  
– Arm Core based on the Armv7 Architecture and  
Thumb®-2 ISA  
– Integrated Digital Signal Processor (DSP)  
– Configurable Nested Vectored Interrupt Controller  
(NVIC)  
– Up to 4 KB of FlexRAM for use as SRAM or  
EEPROM emulation  
– Single Precision Floating Point Unit (FPU)  
– Up to 4 KB Code cache to minimize performance  
impact of memory access latencies  
– QuadSPI with HyperBus™ support  
• Clock interfaces  
– 4 - 40 MHz fast external oscillator (SOSC) with up  
to 50 MHz DC external square input clock in  
external clock mode  
– 48 MHz Fast Internal RC oscillator (FIRC)  
– 8 MHz Slow Internal RC oscillator (SIRC)  
– 128 kHz Low Power Oscillator (LPO)  
– Up to 112 MHz (HSRUN) System Phased Lock  
Loop (SPLL)  
• Mixed-signal analog  
– Up to two 12-bit Analog-to-Digital Converter  
(ADC) with up to 32 channel analog inputs per  
module  
– One Analog Comparator (CMP) with internal 8-bit  
Digital to Analog Converter (DAC)  
• Debug functionality  
– Up to 20 MHz TCLK and 25 MHz SWD_CLK  
– 32 kHz Real Time Counter external clock  
(RTC_CLKIN)  
– Serial Wire JTAG Debug Port (SWJ-DP) combines  
– Debug Watchpoint and Trace (DWT)  
– Instrumentation Trace Macrocell (ITM)  
– Test Port Interface Unit (TPIU)  
– Flash Patch and Breakpoint (FPB) Unit  
• Human-machine interface (HMI)  
– Up to 156 GPIO pins with interrupt functionality  
– Non-Maskable Interrupt (NMI)  
NXP reserves the right to change the production detail specifications as may be  
required to permit improvements in the design of its products.  

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