Advance Technical Information
TrenchTM P & N-Channel
Power MOSFET
Common Drain Topology
P CH.
N CH.
FMP76-010T
VDSS
ID25
- 100V
- 54A
100V
62A
3
4
T1
T2
5
5
RDS(on)
trr(typ)
24mΩ
11mΩ
4
3
70ns
67ns
1
1
2
2
ISOPLUS i4-PakTM
Symbol
Test Conditions
Maximum Ratings
TJ
TJM
Tstg
-55 ... +150
150
-55 ... +150
°C
°C
°C
1
VISOLD
50/60HZ, RMS, t = 1min, leads-to-tab
2500
~V
Isolated Tab
TL
TSOLD
1.6mm (0.062 in.) from case for 10s
Plastic body for 10s
300
260
°C
°C
5
FC
Mounting force
20..120 / 4.5..27
N/lb.
Features
z Silicon chip on Direct-Copper Bond
(DCB) substrate
- UL recognized package
- Isolated mounting surface
- 2500V electrical isolation
z Avalanche rated
z Low QG
z Low Drain-to-Tab capacitance
z Low package inductance
Symbol
CP
Test Conditions
Characteristic Values
Min.
Typ.
Max.
Coupling capacitance between shorted
pins and mounting tab in the case
40
pF
dS ,dA
dS ,dA
pin - pin
pin - backside metal
1.7
5.5
mm
mm
Weight
9
g
Advantages
P - CHANNEL
z
Low gate drive requirement
High power density
Low drain to ground capacitance
Fast switching
z
Symbol
VDSS
Test Conditions
Maximum Ratings
z
TJ = 25°C to 150°C
- 100
- 100
V
V
z
VDGR
TJ = 25°C to 150°C, RGS = 1MΩ
VGSS
VGSM
Continuous
Transient
± 20
± 30
V
V
Applications
z DC and AC motor drives
z Class AB audio amplifiers
z Multi-phase DC to DC converters
z Industrial battery chargers
z Switching power supplies
ID25
IDM
TC = 25°C
- 54
A
A
TC = 25°C, pulse width limited by TJM
- 230
IA
TC = 25°C
TC = 25°C
- 38
1.0
A
J
EAS
PD
TC = 25°C
132
W
DS100037(09/08)
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