2-Mbit (256K × 8) Serial (SPI) F-RAM
serial (SPI), 256K × 8, 40 MHz, industrial
Pin definitions
2
Pin definitions
Table 1
Pin definitions
I/O type
Pin name
Description
Chip Select. This active LOW input activates the device. When HIGH,
the device enters low-power standby mode, ignores other inputs,
and the output is tristated. When LOW, the device internally activates
the SCK signal. A falling edge on CS must occur before every opcode.
CS
Input
Input
Serial Clock. All I/O activity is synchronized to the serial clock. Inputs
are latched on the rising edge and outputs occur on the falling edge.
Because the device is synchronous, the clock frequency may be any
value between 0 MHz and 40 MHz and may be interrupted at any time.
SCK
Serial Input. All data is input to the device on this pin. The pin is
sampled on the rising edge of SCK and is ignored at other times. It
should always be driven to a valid logic level to meet IDD
specifications.
SI[1]
Input
Serial Output. This is the data output pin. It is driven during a read
and remains tristated at all other times. Data transitions are driven
on the falling edge of the serial clock.
SO[1]
Output
Write Protect. This Active LOW pin prevents write operation to the
Status Register when WPEN is set to ‘1’. This is critical because other
write protection features are controlled through the Status Register.
A complete explanation of write protection is provided in “Status
Register and Write Protection” on page 12. This pin must be tied to
VDD if not used.
WP
Input
DNU
VSS
Do Not Use
Do Not Use. This pin must be tied to VDD.
Ground for the device. Must be connected to the ground of the
system.
Power Supply
Power Supply
VDD
Power supply input to the device.
The EXPOSED PAD on the bottom of 8-pin DFN package is not
connected to the die. The EXPOSED PAD should not be soldered on
the PCB.
EXPOSED PAD
No Connect
Note
1. SI may be connected to SO for a single pin data interface.
Datasheet
5
001-90261 Rev. *J
2023-12-22