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FM25V20A-G PDF预览

FM25V20A-G

更新时间: 2024-03-03 10:08:55
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
33页 678K
描述
2Mb 3.3V Industrial 40MHz SPI F-RAM in 8-pin SOIC

FM25V20A-G 数据手册

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2-Mbit (256K × 8) Serial (SPI) F-RAM  
serial (SPI), 256K × 8, 40 MHz, industrial  
Pin definitions  
2
Pin definitions  
Table 1  
Pin definitions  
I/O type  
Pin name  
Description  
Chip Select. This active LOW input activates the device. When HIGH,  
the device enters low-power standby mode, ignores other inputs,  
and the output is tristated. When LOW, the device internally activates  
the SCK signal. A falling edge on CS must occur before every opcode.  
CS  
Input  
Input  
Serial Clock. All I/O activity is synchronized to the serial clock. Inputs  
are latched on the rising edge and outputs occur on the falling edge.  
Because the device is synchronous, the clock frequency may be any  
value between 0 MHz and 40 MHz and may be interrupted at any time.  
SCK  
Serial Input. All data is input to the device on this pin. The pin is  
sampled on the rising edge of SCK and is ignored at other times. It  
should always be driven to a valid logic level to meet IDD  
specifications.  
SI[1]  
Input  
Serial Output. This is the data output pin. It is driven during a read  
and remains tristated at all other times. Data transitions are driven  
on the falling edge of the serial clock.  
SO[1]  
Output  
Write Protect. This Active LOW pin prevents write operation to the  
Status Register when WPEN is set to ‘1. This is critical because other  
write protection features are controlled through the Status Register.  
A complete explanation of write protection is provided in “Status  
Register and Write Protection” on page 12. This pin must be tied to  
VDD if not used.  
WP  
Input  
DNU  
VSS  
Do Not Use  
Do Not Use. This pin must be tied to VDD.  
Ground for the device. Must be connected to the ground of the  
system.  
Power Supply  
Power Supply  
VDD  
Power supply input to the device.  
The EXPOSED PAD on the bottom of 8-pin DFN package is not  
connected to the die. The EXPOSED PAD should not be soldered on  
the PCB.  
EXPOSED PAD  
No Connect  
Note  
1. SI may be connected to SO for a single pin data interface.  
Datasheet  
5
001-90261 Rev. *J  
2023-12-22  

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