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FM18L08_07 PDF预览

FM18L08_07

更新时间: 2024-02-06 19:55:17
品牌 Logo 应用领域
铁电 - RAMTRON 存储
页数 文件大小 规格书
13页 126K
描述
256Kb Bytewide FRAM Memory

FM18L08_07 数据手册

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FM18L08  
256Kb Bytewide FRAM Memory  
Features  
SRAM & EEPROM Compatible  
JEDEC 32Kx8 SRAM & EEPROM pinout  
70 ns Access Time  
140 ns Cycle Time  
256K bit Ferroelectric Nonvolatile RAM  
Organized as 32,768 x 8 bits  
45 year Data Retention  
Unlimited Read/Write Cycles  
NoDelay™ Writes  
Low Power Operation  
3.0V to 3.65V Operation  
15 mA Active Current  
15 µA Standby Current  
Advanced High-Reliability Ferroelectric Process  
Superior to Battery-Backed SRAM  
No Battery Concerns  
Monolithic Reliability  
True Surface Mount Solution, No Rework Steps  
Superior for Moisture, Shock, and Vibration  
Resistant to Negative Voltage Undershoots  
Industry Standard Configuration  
Industrial Temperature -40° C to +85° C  
32-pin “Green” TSOP Package  
28-pin SOIC or DIP Package  
“Green” Packaging Options  
Pin Configurations  
Description  
The FM18L08 is a 256-kilobit nonvolatile memory  
employing an advanced ferroelectric process. A  
ferroelectric random access memory or FRAM is  
nonvolatile and reads and writes like a RAM. It  
provides data retention for 45 years while eliminating  
the reliability concerns, functional disadvantages and  
system design complexities of battery-backed SRAM  
(BBSRAM). Fast write timing and high write  
endurance make FRAM superior to other types of  
nonvolatile memory.  
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NC  
A10  
CE  
NC  
OE  
A11  
A9  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
VSS  
DQ2  
DQ1  
DQ0  
A0  
A8  
A13  
WE  
VDD  
A14  
A12  
A7  
A6  
A5  
A4  
A3  
TSOP-I  
A1  
A2  
NC  
NC  
In-system operation of the FM18L08 is very similar  
to other RAM based devices. Read cycle and write  
cycle times are equal. The FRAM memory, however,  
is nonvolatile due to its unique ferroelectric memory  
process. Unlike BBSRAM, the FM18L08 is a truly  
monolithic nonvolatile memory. It provides the same  
functional benefits of a fast write without the  
disadvantages associated with modules and batteries  
or hybrid memory solutions.  
These capabilities make the FM18L08 ideal for  
nonvolatile memory applications requiring frequent  
or rapid writes in a bytewide environment. The  
availability of a surface-mount package improves the  
manufacturability of new designs, while the DIP  
package facilitates simple design retrofits. Device  
specifications are guaranteed over a temperature  
range of -40°C to +85°C.  
Ordering Information  
FM18L08-70-TG  
FM18L08-70-S  
FM18L08-70-P  
FM18L08-70-SG  
FM18L08-70-PG  
70 ns access, 32-pin “Green” TSOP  
70 ns access, 28-pin SOIC  
70 ns access, 28-pin DIP  
70 ns access, 28-pin “Green” SOIC  
70 ns access, 28-pin “Green” DIP  
This product conforms to specifications per the terms of the Ramtron  
standard warranty. The product has completed Ramtron’s internal  
qualification testing and has reached production status.  
Ramtron International Corporation  
1850 Ramtron Drive, Colorado Springs, CO 80921  
(800) 545-FRAM, (719) 481-7000  
http://www.ramtron.com  
Rev. 3.4  
July 2007  
1 of 13  

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