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FI212C245033

更新时间: 2024-11-21 20:10:31
品牌 Logo 应用领域
太诱 - TAIYO YUDEN LTE
页数 文件大小 规格书
6页 247K
描述
Band Pass Filter,

FI212C245033 技术参数

生命周期:ActiveReach Compliance Code:unknown
风险等级:5.6滤波器类型:BAND PASS FILTER
Base Number Matches:1

FI212C245033 数据手册

 浏览型号FI212C245033的Datasheet PDF文件第2页浏览型号FI212C245033的Datasheet PDF文件第3页浏览型号FI212C245033的Datasheet PDF文件第4页浏览型号FI212C245033的Datasheet PDF文件第5页浏览型号FI212C245033的Datasheet PDF文件第6页 
Special Topic  
2
Technical trends in filters for  
1
These days we can see more and more applications being installed in communication  
devices, W-LAN in notebook PCs, Bluetooth and digital terrestrial broadcasting  
applications in cellular phones.  
In the future, wireless communication and broadcasting technologies will continue  
to further develop, and the wireless market which supports them , including wireless  
components, will further expand as well.  
In this ubiquitously connected society, ICs used in communication systems, and wireless  
devices are required to be high-performance, smaller, and inexpensive.  
In this article, we will explain filter processes, Taiyo Yuden's filter lineup, and notification  
for using filters in desigs in such wireless devices.  
The materials of multilayer filters  
Multilayer ceramics filters, which are used for  
frequency bands ranging from several hundreds  
MHz to several GHz, are composed of low-resist-  
ance conductor materials, such as Ag and Cu, and  
dielectric materials. The conductor materials are  
mainly composed from Ag-based materials.  
This dielectric material contains an Ag con-  
ductor, so we use low temperature co-fired  
ceramic(LTCC) materials, which can be baked  
The manufacturing process of  
multilayer filters  
Figure 1. Process-Flow Diagram  
Mixing/Casting  
The manufacturing process of ceramic compo-  
nents for wireless application, such as multilayer  
Cutting  
Laminating  
filters, is described in  
. Except for the  
Figure 1  
Firing  
Cutting Sheet  
inspection process, multilayer filters can be pro-  
duced by similar process flow to other multilayer  
components such as multilayer inductors.  
Forming terminal  
Making Via Hole  
electrodes  
Int. Conductor pattern  
screening/printing  
Plating  
Inspection  
Shipment  
Filter characteristics are significantly affected by  
the accuracy of manufacturing processes. These  
characteristics are the material dielectric constant,  
thickness of dielectric layer, printing process,  
Stacking/bonding  
at 900 , rather than using capacitor's dielectric  
materials, which can be baked at 1,300  
.
2008  
Taiyo Yuden Navigator  
12  

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