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FI212C245041

更新时间： 2024-11-22 07:52:39

品牌	Logo	应用领域
太诱 - TAIYO YUDEN		/
页数	文件大小	规格书
6页	247K
描述
Band Pass Filter

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FI212C245041 数据手册

Special Topic

Technical trends in filters for

These days we can see more and more applications being installed in communication

devices, W-LAN in notebook PCs, Bluetooth and digital terrestrial broadcasting

applications in cellular phones.

In the future, wireless communication and broadcasting technologies will continue

to further develop, and the wireless market which supports them , including wireless

components, will further expand as well.

In this ubiquitously connected society, ICs used in communication systems, and wireless

devices are required to be high-performance, smaller, and inexpensive.

In this article, we will explain ﬁlter processes, Taiyo Yuden's ﬁlter lineup, and notiﬁcation

for using ﬁlters in desigs in such wireless devices.

The materials of multilayer ﬁlters

Multilayer ceramics ﬁlters, which are used for

frequency bands ranging from several hundreds

MHz to several GHz, are composed of low-resist-

ance conductor materials, such as Ag and Cu, and

dielectric materials. The conductor materials are

mainly composed from Ag-based materials.

This dielectric material contains an Ag con-

ductor, so we use low temperature co-ﬁred

ceramic(LTCC) materials, which can be baked

The manufacturing process of

multilayer ﬁlters

Figure 1. Process-Flow Diagram

Mixing/Casting

The manufacturing process of ceramic compo-

nents for wireless application, such as multilayer

Cutting

Laminating

ﬁlters, is described in

. Except for the

Figure 1

Firing

Cutting Sheet

inspection process, multilayer ﬁlters can be pro-

duced by similar process ﬂow to other multilayer

components such as multilayer inductors.

Forming terminal

Making Via Hole

electrodes

Int. Conductor pattern

screening/printing

Plating

Inspection

Shipment

Filter characteristics are signiﬁcantly affected by

the accuracy of manufacturing processes. These

characteristics are the material dielectric constant,

thickness of dielectric layer, printing process,

Stacking/bonding

at 900 , rather than using capacitor's dielectric

℃

materials, which can be baked at 1,300

℃

2008

Taiyo Yuden Navigator

12 3 4 5 6

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与FI212C245041相关器件

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FI212C245041-T	TAIYO YUDEN	获取价格	Ferrite Chip, 1 Function(s)
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FI212L062002-T	TAIYO YUDEN	获取价格	Ferrite Chip, 1 Function(s)
FI212L062003-T	TAIYO YUDEN	获取价格	FILTER LOWPASS DTV ISDB-T SMD
FI212L062006-T	TAIYO YUDEN	获取价格	FILTER LOWPASS DTV DMB-TH DUB-H
FI212L062007-T	TAIYO YUDEN	获取价格	FILTER LOWPASS DTV DVB-H SMD