ADVANCED INFORMATION
FH Series Quartz Crystal
Legacy NKS2 Series
2.5 x 2.0mm
Miniatuurree QQuuaarrttzz CCrryyssttaall CCeerraammiicc SSMMDD
FH
Frequency Range:
• 16 MHz to 66.0000 MHz (Fundamental)
Characteristics at 25°C ±2°C:
• Frequency Calibration Tolerance: ±10ppm, ±20ppm, or ±30ppm
• Load Capacitance: 7 to 32pF or Series Resonance
• Effective Series Resistance (ESR):
150Ω max (16 to 19.9 MHz)
2.5 x 2.0mm Ceramic SMD
80Ω max (20 to 29.9 MHz)
60Ω max (30 to 66 MHz)
• Drive Level: 10μW typ. (100μW max)
• Shunt Capacitance: 5pF Max
Product Features
• Rugged AT-cut crystal construction
• Miniature 2.5 x 2.0mm ceramic package
Temperature Range:
• Operating: –20 to +70°C or –40 to +85°C
• Available on tape & reel; 8mm tape,
3000 units per reel
• Storage: –55 to +125°C
• Pb-free and RoHS/Green compliant
Temperature Stability:
• ±10ppm, ±20ppm, ±30ppm, or ±50ppm (–20 to +70°C)
Product Description
• ±30ppm, or ±50ppm (–40 to +85°C)
The 4-pad FH Series seam seal devices
incorporate a sub-miniature AT-cut crystal
resonator housed in a standard 2.5 x 2.0mm
ceramic package. These compact crystals are
ideal for surface mounting in densely populated
or small form-factor PCB applications.
Aging at 25°C, First Year:
•±3ppm Max
Reflow Temperature:
•260°C Max, 10 seconds Max
Typical Applications
• Portable / Hand-held PCs
• PCMCIA Cards
• Notebook PC
• Bluetooth
Mechanical
•Shock: JESD22-B104 Condition B
•Solderability: J-STD-002
•Terminal Strength: MIL-STD-883 Method 2004
•Vibration: JESD22-B103
• Wireless LAN
• UWB
•Solvent Resistance: JESD22-B107
•Resistance to Soldering Heat: J-STD-020C Table 5-2 Pb-free devices (3
cycles max)
• ZigBee
• USB
• GPS
Environmental
•Gross Test Leak: JESD22-A109, Condition C
• HDD
•Fine Test Leak: JESD22-A109, Condition A1
•Moisture Resistance: JESD22-A113
• GSM, CDMA, GPRS
•Insulation Resistance: 500 MΩ min (100 VDC)
SaRonix-eCera™ is a Pericom® Semiconductor company
•
US: +1-408-435-0800 TW: +886-3-4518888
•
www.saronix-ecera.com
All specifications are subject to change without notice.
FH REV2008_OCT14_01.6
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