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FF200R33KF2C PDF预览

FF200R33KF2C

更新时间: 2024-01-07 06:23:59
品牌 Logo 应用领域
EUPEC 晶体晶体管双极性晶体管局域网
页数 文件大小 规格书
8页 291K
描述
IGBT-inverter

FF200R33KF2C 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:MODULE
包装说明:FLANGE MOUNT, R-XUFM-X8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.65Is Samacsys:N
外壳连接:ISOLATED最大集电极电流 (IC):330 A
集电极-发射极最大电压:3300 V配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
门极-发射极最大电压:20 VJESD-30 代码:R-XUFM-X8
元件数量:2端子数量:8
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):2200 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:UNSPECIFIED端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管元件材料:SILICON
标称断开时间 (toff):1900 ns标称接通时间 (ton):480 ns
VCEsat-Max:4.25 VBase Number Matches:1

FF200R33KF2C 数据手册

 浏览型号FF200R33KF2C的Datasheet PDF文件第2页浏览型号FF200R33KF2C的Datasheet PDF文件第3页浏览型号FF200R33KF2C的Datasheet PDF文件第4页浏览型号FF200R33KF2C的Datasheet PDF文件第5页浏览型号FF200R33KF2C的Datasheet PDF文件第6页浏览型号FF200R33KF2C的Datasheet PDF文件第7页 
Technische Information / technical information  
IGBT-Module  
IGBT-modules  
FF200R33KF2C  
Vorläufige Daten  
preliminary data  
IGBT-Wechselrichter / IGBT-inverter  
Höchstzulässige Werte / maximum rated values  
Kollektor-Emitter-Sperrspannung  
collector-emitter voltage  
TÝÎ = 25°C  
TÝÎ = -25°C  
3300  
V†Š»  
3300  
V
Kollektor-Dauergleichstrom  
DC-collector current  
T† = 80°C  
T† = 25°C  
I† ÒÓÑ  
I†  
200  
330  
A
A
Periodischer Kollektor Spitzenstrom  
repetitive peak collector current  
t« = 1 ms, T† = 80°C  
T† = 25°C  
I†ç¢  
PÚÓÚ  
400  
2,20  
+/-20  
A
kW  
V
Gesamt-Verlustleistung  
total power dissipation  
Gate-Emitter-Spitzenspannung  
gate-emitter peak voltage  
V•Š»  
Charakteristische Werte / characteristic values  
min. typ. max.  
Kollektor-Emitter Sättigungsspannung  
collector-emitter saturation voltage  
I† = 200 A, V•Š = 15 V, TÝÎ = 25°C  
I† = 200 A, V•Š = 15 V, TÝÎ = 125°C  
V†Š ÙÈÚ  
3,40 4,25  
4,30 5,00  
V
V
Gate-Schwellenspannung  
gate threshold voltage  
I† = 20,0 mA, V†Š = V•Š, TÝÎ = 25°C  
V•ŠÚÌ  
Q•  
4,2  
5,1  
4,00  
2,5  
6,0  
V
µC  
Â
Gateladung  
gate charge  
V•Š = -15 V ... +15 V, V†Š = 1800V  
TÝÎ = 25°C  
Interner Gatewiderstand  
internal gate resistor  
R•ÍÒÚ  
CÍþÙ  
CØþÙ  
I†Š»  
I•Š»  
Eingangskapazität  
input capacitance  
f = 1 MHz, TÝÎ = 25°C, V†Š = 25 V, V•Š = 0 V  
f = 1 MHz, TÝÎ = 25°C, V†Š = 25 V, V•Š = 0 V  
V†Š = 3300 V, V•Š = 0 V, TÝÎ = 25°C  
V†Š = 0 V, V•Š = 20 V, TÝÎ = 25°C  
25,0  
1,40  
nF  
nF  
mA  
nA  
Rückwirkungskapazität  
reverse transfer capacitance  
Kollektor-Emitter Reststrom  
collector-emitter cut-off current  
5,0  
Gate-Emitter Reststrom  
gate-emitter leakage current  
400  
Einschaltverzögerungszeit (ind. Last)  
turn-on delay time (inductive load)  
I† = 200 A, V†Š = 1800 V  
V•Š = ±15 V, R•ÓÒ = 5,6 Â, C•Š = 33,0 nF, TÝÎ = 25°C  
V•Š = ±15 V, R•ÓÒ = 5,6 Â, C•Š = 33,0 nF, TÝÎ = 125°C  
tÁ ÓÒ  
tØ  
0,28  
0,28  
µs  
µs  
Anstiegszeit (induktive Last)  
rise time (inductive load)  
I† = 200 A, V†Š = 1800 V  
V•Š = ±15 V, R•ÓÒ = 5,6 Â, C•Š = 33,0 nF, TÝÎ = 25°C  
V•Š = ±15 V, R•ÓÒ = 5,6 Â, C•Š = 33,0 nF, TÝÎ = 125°C  
0,18  
0,20  
µs  
µs  
Abschaltverzögerungszeit (ind. Last)  
turn-off delay time (inductive load)  
I† = 200 A, V†Š = 1800 V  
V•Š = ±15 V, R•ÓËË = 7,5 Â, C•Š = 33,0 nF, TÝÎ = 25°C  
V•Š = ±15 V, R•ÓËË = 7,5 Â, C•Š = 33,0 nF, TÝÎ = 125°C  
tÁ ÓËË  
tË  
1,55  
1,70  
µs  
µs  
Fallzeit (induktive Last)  
fall time (inductive load)  
I† = 200 A, V†Š = 1800 V  
V•Š = ±15 V, R•ÓËË = 7,5 Â, C•Š = 33,0 nF, TÝÎ = 25°C  
V•Š = ±15 V, R•ÓËË = 7,5 Â, C•Š = 33,0 nF, TÝÎ = 125°C  
0,20  
0,20  
µs  
µs  
Einschaltverlustenergie pro Puls  
turn-on energy loss per pulse  
I† = 200 A, V†Š = 1800 V, L» = 70 nH  
V•Š = ±15 V, R•ÓÒ = 5,6 Â, C•Š = 33,0 nF, TÝÎ = 25°C  
V•Š = ±15 V, R•ÓÒ = 5,6 Â, C•Š = 33,0 nF, TÝÎ = 125°C  
EÓÒ  
EÓËË  
235  
365  
mJ  
mJ  
Abschaltverlustenergie pro Puls  
turn-off energy loss per pulse  
I† = 200 A, V†Š = 1800 V, L» = 70 nH  
V•Š = ±15 V, R•ÓËË = 7,5 Â, C•Š = 33,0 nF, TÝÎ = 25°C  
V•Š = ±15 V, R•ÓËË = 7,5 Â, C•Š = 33,0 nF, TÝÎ = 125°C  
215  
255  
mJ  
mJ  
Kurzschlußverhalten  
SC data  
t« ù 10 µs, V•Š ù 15 V  
TÝÎù125°C, V†† = 2500 V, V†ŠÑÈà = V†Š» -LÙ†Š ·di/dt  
I»†  
1000  
A
Innerer Wärmewiderstand  
thermal resistance, junction to case  
pro IGBT  
per IGBT  
RÚÌœ†  
RÚ̆™  
57,0 K/kW  
K/kW  
Übergangs-Wärmewiderstand  
thermal resistance, case to heatsink  
pro IGBT / per IGBT  
ð«ÈÙÚþ = 1 W/(m·K)  
49,0  
/
ðÃØþÈÙþ = 1 W/(m·K)  
prepared by: Jürgen Biermann  
approved by: Christoph Lübke  
date of publication: 2003-6-12  
revision: 2.0  
1

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