Datasheet > FEP30DP

FEP30DP

更新时间： 2024-11-18 12:57:43

品牌	Logo	应用领域
赛灵思 - XILINX		二极管瞄准线功效局域网
页数	文件大小	规格书
11页	256K
描述
30.0 Ampere Heatsink Dual Common Cathode Ultra Fast Recovery Half Bridge Rectifiers

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数据手册

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FEP30DP 数据手册

DDR2-400, 533

Single Rank, x8 Registered SDRAM DIMMs

256MB - W1D32M72R8

512MB - W1D64M72R8

1GB

2GB

- W1D128M72R8

- W1D256M72R8 (Preliminary*)

Features:

Figure 1: Available layouts

Layout A:

•

240-pin Registered ECC DDR2 SDRAM Dual-In-

Line Memory Module for DDR2-400 and DDR2-533

JEDEC standard VDD=1.8V (+/- 0.1V) power

supply

One rank 256MB, 512MB, 1GB, and 2GB

Modules are built with 18 x8 DDR2 SDRAM

devices in a 60-ball FBGA package

ECC error detection and correction

Programmable CAS Latency of 3 and 4; Burst

Length of 4 and 8

Auto Refresh and Self Refresh Mode

OCD (Off-Chip Driver Impedance Adjustment) and

ODT (On-Die Termination)

SPD (Serial Presence Detect) with EEPROM

All input/output are SSTL_18 compatible

All contacts are gold plated

•

1.181"

•

Layout B:

•

1.0"

•

Front view of double-sided DIMM (see detail physical dimensions

at the back)

•

Speed Grades:

Speed Grade

-5

-3.75

Units

One clock delay for register

Module Speed Grade

PC2-3200 PC2-4200

Speed @ CL3

Speed @ CL4

Speed @ CL5

400

MHz

533

Note: See Product ordering for full naming guide

Description:

The following specification covers the W1D32M72R8, W1D64M72R8, W1D128M72R8, and W1D256M72R8

family of Single-Rank Registered ECC DDR2 modules using x8 FBGA SDRAMs. Please reference Figure 1 for

available layout configurations and the product ordering guide on the final page of this specification for available

options including speed grade and silicon manufacturer.

Address Summary Table:

256MB

32M x 72

512MB

64M x 72

1GB

128M x 72

2GB

256M x 72

Module Configuration

Refresh

Device Configuration

32M x 8

(9 components)

A0-A13

A0-A9

64M x 8

(9 components)

A0-A13

A0-A9

128M x 8

(9 components)

A0-A14

A0-A9

256M x 8

(9 components)

A0-A14

A0-A9

Row Addressing

Column Addressing

Module Rank

*Specifications are for reference purposes only and are subject to change by Wintec without notice.

DDR2_RDIMM_1 rank_x8_spec

Rev. 1.0 - December, 04

Wintec Industries, Inc., reserves the right to change datasheets and/or products without any notice.

 2004 Wintec Industries, Inc.

12 3 4 5 6 7...11

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与FEP30DP相关器件

型号	品牌	获取价格	描述	数据表
FEP30FP	VISHAY	获取价格	FAST EFFICIENT PLASTIC RECTIFIER
FEP30FP	XILINX	获取价格	30.0 Ampere Heatsink Dual Common Cathode Ultra Fast Recovery Half Bridge Rectifiers
FEP30GP	XILINX	获取价格	30.0 Ampere Heatsink Dual Common Cathode Ultra Fast Recovery Half Bridge Rectifiers
FEP30GP	VISHAY	获取价格	FAST EFFICIENT PLASTIC RECTIFIER
FEP30GP-E3/45	VISHAY	获取价格	DIODE 15 A, 400 V, SILICON, RECTIFIER DIODE, TO-247AD, ROHS COMPLIANT, PLASTIC, TO-3P, 3 P
FEP30GP-E345	VISHAY	获取价格	Dual Common Cathode Ultrafast Rectifier
FEP30HP	XILINX	获取价格	30.0 Ampere Heatsink Dual Common Cathode Ultra Fast Recovery Half Bridge Rectifiers
FEP30HP	VISHAY	获取价格	FAST EFFICIENT PLASTIC RECTIFIER
FEP30JP	VISHAY	获取价格	FAST EFFICIENT PLASTIC RECTIFIER
FEP30JP	XILINX	获取价格	30.0 Ampere Heatsink Dual Common Cathode Ultra Fast Recovery Half Bridge Rectifiers

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