SEMICONDUCTOR
FDR0530
TECHNICAL DATA
Surface Mount
Schottky Power Rectifier
Pb-Free package is available
FDR0530
The
uses the Schottky Barrier principle with a large
area metal−to−silicon power diode. Ideally suited for low voltage,
high frequency rectification or as free wheeling and polarity
protection diodes in surface mount applications where compact size
and weight are critical to the system. This package also provides an
easy to work with alternative to leadless 34 package style. These
state−of−the−artdevices have the following features:
Features
• Guardring for Stress Protection
• Low Forward Voltage
SOD–123
• 125°C Operating Junction Temperature
• Epoxy Meets UL 94, V−0 @ 0.125 in
• Package Designed for Optimal Automated Board Assembly
• Pb−Free Packages are Available
Mechanical Characteristics
ORDERING INFORMATION
• Reel Options: FDR0530T1G = 3,000 per 7 in reel/8 mm tape
FDR0530T3G = 10,000 per 13 in reel/8 mm tape
• Device Marking:B3
• Polarity Designator: Cathode Band
• Weight: 11.7 mg (approximately)
• Case: Epoxy, Molded
†
Device
Package
Shipping
FDR0530T1G
FDR0530T3G
SOD−123
(Pb−Free)
3000/Tape & Reel
SOD−123
(Pb−Free)
10,000/Tape & Reel
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
30
V
RRM
RWM
R
V
V
Average Rectified Forward Current
I
0.5
5.5
A
A
F(AV)
(Rated V , T = 100 C)
R
L
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
FSM
Storage Temperature Range
T
−65 to +150
−65 to +125
1000
C
C
stg
Operating Junction Temperature
T
J
Voltage Rate of Change (Rated V )
dv/dt
V/ s
V
R
ESD Rating:
Machine Model = C
Human Body Model = 3B
> 400
> 8000
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2009. 8. 18
Revision No : 0
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