Bulletin I0533J rev. A 04/06
FD080H02A5F
FRED Die in Wafer Form
200V
VF = 0.9V
(max.)
z 100% Tested at Probe c
z Available in Tape and Reel (upon request)
z Chip Pack, and Sawn on Film d
5" Wafer
Electrical Characteristics (@ T = 25°C)
J
Parameter
Description
Typical Forward Voltage
Typical Forward Voltage
Typical Forward Voltage
Min
–––
–––
–––
Typ
0.83
0.74
0.74
–––
Max
0.9V
0.8
Test Conditions
VFM
VFM
VFM
VRRM
IRM
trr
TJ = 25°C, IF = 3A
3)
3)
4)
TJ = 25°C, IF = 1A
–––
–––
3 μA
–––
–––
TJ = 25°C, IF = 1A
Minimum Reverse Breakdown Voltage 600v
TJ = 25°C, IRRM = 100μA
TJ = 25°C, VRRM = 200V
IF = 1A, di/dt = 100A/μs, VR = 30v
Max. Reverse Leakage Current
Typ. Reverse Recovery Time
Typ. Reverse Recovery Time
–––
–––
–––
–––
26ns
21ns
4)
trr
IF = 3A, di/dt = 200A/μs, VR = 160v 3)
Mechanical Data
Nominal Back Metal Composition, Thickness:
Nominal Front Metal Composition, Thickness:
Dimensions:
Cr-Ni-Ag ( 1kA-2kA-3kA)
99%Al, 1%Si (3microns)
0.080" x 0.080" (see drawing)
125 mm
Wafer Diameter:
Wafer Thickness:
14 mils
Scribe Line Width
66 ±10 μm
Reject Ink Dot Size
0.25 mm Diameter Minimum
Store in original container, in dessicated
nitrogen, with no contamination
For optimum electrical results, die attach
temperature should not exceed 300 °C
Recommended Storage Environment:
Recommended Die Attach Conditions:
Reference Packaged Part
IRM, trr and RthJC/ RthJA data refer to packed die in TO220
Die Outline
NOTES:
40 (1.57)
Wafer flat alligned with
side b of the die
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS).
2. CONTROLLING DIMENSION (INCH):
0.35 ± 0.01
a
c
(14 ± 0.4)
3. DIMENSIONS AND TOLERANCES:
a = 2.032 +0, - 0.01
(80 +0, - 0.4)
b = 2.032 +0, - 0.01
(80 +0, - 0.4)
C
c = 1.604 +0, - 0.01
(63.14 +0, - 0.4)
d = 1.604 +0, - 0.01
(63.14 +0, - 0.4)
A
4. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
5. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Ø
125 (4.92)
Note:
1) The above data sheet is based on IR sample testing under certain predetermined and assumed conditions, and is
provided for illustration purposes only. Customers are encouraged to perform testing in actual proposed packaged
and use conditions. IR die products are tested using IR-based quality assurance procedures and are manufactured
using IR’s established processes. Programs for customer-specified testing are available upon request. IR has
experienced assembly yields of generally 95% or greater for individual die; however, customer’s results may vary.
Estimates such as those described and set forth in this data sheet for semiconductor die will vary depending on a
number of packaging, handling, use and other factors. Sold die may not perform on an equivalent basis to standard
package products and are therefore offered with a limited warranty as described in IR’s applicable standard terms
and conditions of sale. All IR die sales are subject to IR’s applicable standard terms and conditions of sale, which
are available upon request.
2) Part number shown is for die in waveform. Contact factory for these other options.
3) V and t limits refer to packaed devices in TO-220 unless otherwise stated.
rr
F
4) V and t limits refer to wafer level
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F
1