Datasheet > FCN-244M050-G/0

FCN-244M050-G/0

更新时间： 2024-10-27 04:18:31

品牌	Logo	应用领域
富士通 - FUJITSU		/
页数	文件大小	规格书
5页	150K
描述
FOR BOARD-TO-BOARD CONNECTION

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数据手册

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FCN-244M050-G/0 数据手册

FOR BOARD-TO-BOARD CONNECTION

240 SERIES (LOW-PROFILE STACKING)

■ FEATURES

• The connectors can connect boards in parallel

(stacking) at intervals of 8 mm (0.31 in.) to 14 mm

(0.55 in.) for various applications.

• Connectors with ten different numbers of contacts are

available for various purposes: 20 to 100 in steps of

ten and 120.

• Connectors are surface mount compatible.

• 1.27 mm (0.050 in.) pitch contact arrangement in two

rows enables high-density mounting. Tails are spaced

in a four-row staggered arrangement (2.54 mm ×

1.905 mm) (0.100 in. × 0.075 in.) for easy patterning

on PC boards.

• Bellows contacts ensure stable contact preventing

pins from bending. The bellows contacts also have

excellent stability with repeated insertion and

extraction.

■ SPECIFICATIONS

■ MATERIALS

Item

Materials

Item

Specifications

–55°C to +105°C

Insulator

Polyamide resin (94V-0)

Copper alloy

Operating temperature range

Current rating

Conductor

DC 1 A

Contact

Gold plating (PAGOS)

Palladium plating

Voltage rating

AC 250 V

Plating

Terminal

Contact resistance

Insulation resistance

Dielectric withstand voltage

35 mΩ max. (DC 6 V, 0.1 A)

1000 MΩ min. (DC 500 V)

AC 750 V for 1 minute

Specifications

subject to change

Dimensions are in millimeters (inches)

www.fcai.fujitsu.com

12 3 4 5

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