Rev. Aug. 11
SolidMatrix® 1206 Slow Blow Surface Mount Fuses
Features:
xꢀ High inrush current withstanding capability
xꢀ Multilayer monolithic structure with glass ceramic body and silver
fusing element
xꢀ Silver termination with nickel and pure-tin solder plating, providing
excellent solderability
xꢀ Standard EIA1206/EIAJ3216 size
xꢀ Compatible with both wave and reflow soldering processes
xꢀ Operating temperature range: -55°C to +125°C (with de-rating)
xꢀ RoHS compliant
Shape and Dimensions:
0.126 0.008
(3.20 0.20)
Clearing Time Characteristics ( Slow Blow):
0.063 0.008
(1.60 0.20)
SOLDER
% of current rating
Clearing time at 25oC
4 hours min.
100 %
200 %
300 %
NICKEL
SILVER
METALLIZATION
1 second min.
120 seconds max.
0.1 seconds min.
3 seconds max.ꢂ
0.038
(0.97 0.20)
0.008
FUSE ELEMENT
800 %ꢂ
0.002 seconds min.ꢂ
0ꢃ05 seconds max.ꢂ
0.020 0.010
(0.51 0.25)
Agency Approval: Recognized Under the Components
Program of Underwriters Laboratories. File Number: E232989
Recommended Land Pattern:
Patents: U.S. Patent numbers 6,034,589; 6,602,766;
0.059
(1.50)
7,268,661 B2; and other pending patents.
0.071
(1.80)
Interrupting Ratings:
0.173
(4.40)
Inch (mm)
1.0 A - 5.5 A
6.0 A - 8.0 A
50 A at rated voltages
60 A at rated voltage
Marking (Optional): Red Marking Character Code
1.0 A:E, 1.25 A:F, 1.5 A:G, 2.0 A:I, 2.5 A:J, 3.0 A:K, 3.5 A:L, 4.0 A:M,
4.5 A:T, 5.0 A:N, 5.5 A:U, 6.0 A:O, 7.0 A:P, 8.0 A:Rꢂ
Ordering Information:
Current Rating
(A)
Voltage Rating
Nominal Cold DCR
Nominal I2t
(A2s)2
Part Number
(VDC)
(ȍ)1
F1206SB1000V063T
F1206SB1250V063T
F1206SB1500V063T
F1206SB2000V063T
F1206SB2500V032T
F1206SB3000V032T
F1206SB3500V032T
F1206SB4000V032T
F1206SB4500V032T
F1206SB5000V032T
F1206SB5500V024T
F1206SB6000V024T
F1206SB7000V024T
F1206SB8000V024T
1.0
1.25
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
7.0
8.0
63
63
63
63
32
32
32
32
32
32
24
24
24
24
0.360
0.200
0.150
0.088
0.065
0.034
0.028
0.024
0.020
0.018
0.014
0.011
0.010
0.009
0.11
0.22
0.23
0.63
0.90
1.20
1.60
2.20
3.60
5.30
6.40
8.50
10.0
16.9
1. Measured at 10 % of rated current and 25ºC ambient
2. Melting I2t at 0.001 second clearing time
ꢀꢁꢂ
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