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EZR32LG230F128R55G-B0 PDF预览

EZR32LG230F128R55G-B0

更新时间: 2024-11-09 00:19:27
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This change does not impact form, function, quality or reliability.

EZR32LG230F128R55G-B0 数据手册

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Process Change Notice #1506172  
____________________________________________________________________________________________________  
User Registration  
Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document  
updates, new product announcements, “how-to” and design documents, product change notices (PCN) and other valuable content  
available only to registered users. http://www.silabs.com/profile  
PCN Date: 6/17/2015  
Effective Date: 6/17/2015  
Title: EZR32LG and EZR32WG Data sheet Revision Notification  
Originator: Kavita Char  
Phone: 408-702-1297  
Phone: 512-532-5261  
Dept: SRW Marketing  
Dept: Sales  
Customer Contact: Kathy Haggar  
PCN Type:  
Data sheet  
Foundry  
Packing  
Product Revision  
Assembly  
Test  
Labeling  
Other  
Discontinuance  
Last Order Date: Not Applicable  
PCN Details  
Description of Change:  
Silicon Labs is pleased to announce availability of v1.1 of EZR32LG and EZR32WG wireless MCU data  
sheets. The affected data sheets are: EZR32LG230, EZR32LG330, EZR32WG230 and EZR32WG330.  
The new data sheet revision includes the changes listed below:  
Updated OPNs in Ordering Section.  
USART0 in Configuration Summary table changed to USARTRF0.  
Sleep current corrected from 40 nA to 20 nA.  
GPIO number corrected from 41 to 38.  
Number of operational amplifiers corrected from 3 to 2.  
Added "EZRadio and EZRadioPRO Transceivers GPIO Configuration" section.  
Updated Table 5.1 Device Pinout: Revised Pin 10, Pin 11, Pin 61, and Pin 62.  
Updated Table 5.2 Alternate Functionality Overview: Removed GPIO0 and GPIO1.  
Revised Top Marking Table: Corrected Line 2 Marking row.  
Revised Table 3.2 Configuration Table: Added USB.  
Updated Section 5.6 (QFN64 Package) and Table 5.4 (QFN64 package dimensions)*.  
Updated Section 6.1—PCB Land Pattern Dimensions *  
* This revision reflects the actual package dimension that is in production and affects only the  
documentation. There is no change to the package/product.  
Reason for Change:  
Updated data sheets to include new radio sub-section describing the MCU-RF interface, updated  
device package dimensions and updates to pinout tables and features section.  
Impact on Form, Fit, Function, Quality, Reliability:  
This change does not impact form, function, quality or reliability. The fit of the actual product is  
not changing; however, the package dimensions are being corrected in the data sheets to reflect  
the actual dimensions of the product.  
W7206F1 Process Change Notice Form rev AU  
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in  
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 4  

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