Chip Resistor Array
Chip Resistor Array
Type:
EXB1 : 0201 Array
EXB2 : 0402 Array
EXB3 : 0603 Array
EXBN: 0402 Array
EXBV : 0603 Array
EXBS : 0805 Array
■ Features
● High density
2 resistors in 0.8 mm ꢀ 0.6 mm size (EXB14V)
4 resistors in 1.4 mm ꢀ 0.6 mm size (EXB18V)
2 resistors in 1.0 mm ꢀ 1.0 mm size (EXB24V)
4 resistors in 2.0 mm ꢀ 1.0 mm size (EXB28V, N8V)
8 resistors in 3.8 mm ꢀ 1.6 mm size (EXB2HV)
2 resistors in 1.6 mm ꢀ 1.6 mm size (EXB34V, V4V)
4 resistors in 3.2 mm ꢀ 1.6 mm size (EXB38V, V8V)
4 resistors in 5.1 mm ꢀ 2.2 mm size (EXBS8V)
● Improvement of placement efficiency
Placement efficiency of Chip Resistor Array is two, four or eight times of the flat type chip resistor
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
X
B
V
8
V
4
7
2
J
V
Packaging Methods
Packaging
Embossed
Product Code
Schematics
Chip Resistor Array
Type: inches
No. of Terminal
Resistance Value
Resistance
Tolerance
4
8
4 Terminal
8 Terminal
Code
Isolated The first two digits are
Thick Film
Chip Resistor
Networks
V
type
significant figures of
resistance value and
the third one denotes
the number of zeros
following. Jumper is
expressed by R00
1
2
3
N
V
S
0201 Array
5 %
J
Carrier Taping
H 16 Terminal
0402 Array
0603 Array
0402 Array
Jumper
Nil
0
Convex Terminal
(S8V)
Punched Carrier Taping
2 mm pitch
(14V, 18V, 24V, 28V, N8V)
X
0603 Array Concave Terminal
0805 Array
Example: 222: 2.2 kȑ
Punched Carrier Taping
4 mm pitch
(2HV, 34V, 38V, V4V, V8V)
V
■ Construction (Example : Concave Terminal)
■ Schematics
● Isolated type
14V, 24V, 34V, V4V
18V, 28V, N8V, 38V, V8V, S8V
4 resistors
2 resistors
4
3
8
7
6
5
Protective coating
1
2
1
2
3
4
Alumina substrate
2HV
8 resistors
Electrode (Outer)
Thick film
16 15 14 13 12 11 10
9
8
Electrode (Between)
resistive element
Electrode (Inner)
1
2
3
4
5
6
7
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
May. 2005