ESDBL7471BP
ESD Protection Diode
PINNING
DESCRIPTION
Anode
PIN
1
Features
• Low capacitance
• Low leakage current
• Low clamping voltage
Anode
2
1
2
Transparent top view
Simplified outline DFN1006-2B and symbol
Absolute Maximum Ratings (Ta = 25℃)
Parameter
Symbol
PPK
Value
80
Unit
W
Peak Pulse Power (tp = 8/20 µs)
Peak Pulse Current (tp = 8/20 µs)
IPP
5
A
Air
Contact
± 20
± 20
ESD (IEC61000-4-2)
VESD
KV
Power Dissipation
PD
Tj
300
mW
℃
Operation Junction Temperature Range
Storage Temperature Range
- 55 to + 125
- 55 to + 150
Tstg
℃
Thermal Resistance
Parameter
Symbol
RθJA
Value
400
Unit
Typical Thermal Resistance Junction to Ambient 1)
1) Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
℃/W
Characteristics at Ta = 25℃
Parameter
Symbol
VRWM
Min.
-
Typ.
-
Max.
5.3
Unit
Reverse Stand-Off Voltage
V
V
Reverse Breakdown Voltage
at IR = 1 mA
V(BR)R
IR
7
-
-
-
-
-
Reverse Current
at VR = 5.3 V
50
15
nA
V
Clamping Voltage
VC
-
at IPP = 1 A, tp = 8/20 µs
ESD Clamping Voltage
at ITLP = 4 A, tp = 0.2/100 ns
at ITLP =16 A, tp = 0.2/100 ns
VCL
-
-
16.7
31.6
-
-
V
Junction Capacitance
at VR = 0 V, f = 1 MHz
Dynamic Resistance 1)
Cj
-
-
-
0.4
-
pF
Rdyn
1.2
Ω
1) Dynamic Resistance calculated from ITLP = 4A to ITLP = 16 A .
1 / 3
®
Dated: 22/08/2023 Rev : 02