ES3ABF THRU ES3KBF
(T =25℃ Unless otherwise specified)
■Electrical Characteristics
a
TEST
ES3ABFES3BBFES3CBFES3DBFES3FBFES3GBFES3HBFES3JBFES3KBF
PARAMETER
SYMBOL
UNIT
CONDITIONS
Maximum instantaneous
forward voltage drop per diode
V
V
IFM=3.0A
0.95
1.3
1.7
1.85
F
IF=0.5A,IR=1.0A,
Irr=0.25A
Maximum reverse recovery time
trr
ns
35
5
Tj =25℃
Maximum DC reverse current at
rated DC blocking voltage per
diode
I
μA
R
100
Tj =125℃
Thermal Characteristics (T =25℃ Unless otherwise specified)
■
a
ES3ABF ES3BBF ES3CBF ES3DBF ES3FBF ES3GBF ES3HBF ES3JBF ES3KBF
PARAMETER
SYMBOL
UNIT
(1)
RθJ-A
60
20
15
(1)
Typical Thermal Resistance
RθJ-L
℃/W
(1)
RθJ-C
Note:
(1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.3" x 0.3" (8.0 mm x 8.0 mm) copper pad areas
Characteristics (Typical)
■
FIG1:Io‐TL Curve
FIG2:Surge Forward Current Capability
3.5
120
3.0
100
8.3ms Single Half Sine Wave
2.5
80
2.0
60
1.5
40
1.0
Resistive or Inductive Load
P.C.B. Mounted on 0.3"×0.3"
(8.0mm×8.0mm)Copper Pad Areas
0.5
20
0
0
0
25
50
75
100
125
150
1
10
100
Number of Cycles
Lead Temperature(℃)
2 / 5
Yangzhou Yangjie Electronic Technology Co., Ltd.
S-S4106
Rev. 1.0, 18-Oct-21
www.21yangjie.com