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ES2D PDF预览

ES2D

更新时间: 2024-11-30 11:11:47
品牌 Logo 应用领域
安森美 - ONSEMI 功效光电二极管
页数 文件大小 规格书
5页 146K
描述
2.0A超快速恢复整流器

ES2D 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMB, 2 PINReach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.10.00.80
Factory Lead Time:1 week风险等级:0.97
应用:EFFICIENCY配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):0.9 VJEDEC-95代码:DO-214AA
JESD-30 代码:R-PDSO-C2JESD-609代码:e3
湿度敏感等级:1最大非重复峰值正向电流:50 A
元件数量:1相数:1
端子数量:2最高工作温度:150 °C
最低工作温度:-55 °C最大输出电流:2 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
最大功率耗散:1.66 W认证状态:Not Qualified
最大重复峰值反向电压:200 V最大反向恢复时间:0.02 µs
子类别:Rectifier Diodes表面贴装:YES
端子面层:TIN (SN)端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

ES2D 数据手册

 浏览型号ES2D的Datasheet PDF文件第2页浏览型号ES2D的Datasheet PDF文件第3页浏览型号ES2D的Datasheet PDF文件第4页浏览型号ES2D的Datasheet PDF文件第5页 
DATA SHEET  
www.onsemi.com  
Fast Rectifiers  
ES2A-ES2D  
SMB  
CASE 403AF  
Features  
For Surface Mount Applications  
GlassPassivated Junction  
LowProfile Package  
MARKING DIAGRAM  
Easy Pick and Place  
Builtin Strain Relief  
Superfast Recovery Times for High Efficiency  
These are PbFree Devices  
ZYWW  
ES2x  
(COLOR BAND DENOTES CATHODE)  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Z
Y
= Assembly Plant Code  
= Year  
Symbol  
Parameter  
Value  
Unit  
WW  
ES2x  
= Work Week  
= Specific Device Code  
x = A, B, C, D  
V
RRM  
Maximum Repetitive Reverse Voltage  
V
ES2A  
ES2B  
ES2C  
ES2D  
50  
100  
150  
200  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 3  
of this data sheet.  
I
Average Rectified Forward Current,  
2.0  
A
A
F(AV)  
0.375Lead Length at T = 115°C  
L
I
NonRepetitive Peak Forward Surge  
Current, 8.3 ms Single HalfSine Wave  
50  
FSM  
T
Storage Temperature Range  
55 to +150  
55 to +150  
°C  
°C  
STG  
T
J
Operating Junction Temperature Range  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Symbol  
Parameter  
Value  
1.66  
75  
Unit  
W
P
D
Power Dissipation  
R
Thermal Resistance,  
Junction to Ambient (Note 1)  
°C/W  
θ
JA  
R
Thermal Resistance,  
Junction to Lead (Note 1)  
20  
°C/W  
θ
JL  
1. Device mounted on FR4 PCB 0.013 mm.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Value  
ES2A  
ES2B  
ES2C  
ES2D  
Symbol  
Parameter  
Maximum Forward Voltage  
Reverse Recovery Time  
Test Conditions  
I = 2.0 A  
Unit  
V
V
F
0.90  
20  
F
t
rr  
I = 0.5 A, I = 1.0 A,  
ns  
F
RR  
R
I
= 0.25 A  
I
Maximum Reverse Current at Rated V  
T = 25_C  
10  
mA  
R
R
A
350  
T = 100_C  
A
C
Total Capacitance  
V
R
= 4.0 V, f = 1.0 MHz  
18  
pF  
T
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
© Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
April, 2022 Rev. 2  
ES2D/D  
 

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