NOT RECOMMENDED FOR NEW DESIGNS
USE ES1A-LTP~ES1J-LTP SERIES
M C C
ES1A
THRU
ES1M
TM
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Micro Commercial Components
Features
•
Halogen free available upon request by adding suffix "-HF"
•
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
1 Amp Ultra Fast
Recovery
Compliant. See ordering information)
Epoxy meets UL 94 V-0 flammability rating
·
·
Moisture Sensitivity Level 1
Silicon Rectifier
50 to 1000 Volts
x
x
High Temp Soldering: 260qC for 10 Seconds At Terminals
Superfast Recovery Times For High Efficiency
Maximum Ratings
x
x
x
Operating Temperature: -50qC to +150qC
Storage Temperature: -50qC to +150qC
Maximum Thermal Resistance; 15qC/W Junction To Lead
DO-214AC
(HSMA) (High Profile)
MCC
Part
Number
Maximum
Recurrent
Marking Peak Reverse
Voltage
Maximum
RMS
Voltage
Maximum
DC
Blocking
Voltage
50V
H
Device
Cathode Band
J
ES1A
ES1B
ES1C
ES1D
ES1G
ES1J
ES1K
ES1M
ES1A
ES1B
ES1C
ES1D
ES1G
ES1J
ES1K
ES1M
50V
100V
150V
200V
400V
600V
800V
1000V
35V
70V
100V
150V
105V
140V
280V
420V
560V
700V
200V
400V
A
C
600V
800V
1000V
E
D
B
F
G
Electrical Characteristics @ 25qC Unless Otherwise Specified
Average Forward
Current
IF(AV)
1.0A
Ta = 75qC
DIMENSIONS
INCHES
MIN
.078
.067
.002
---
MM
MIN
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
ES1A-D
ES1G-J
ES1K~M
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
IFSM
30A
8.3ms, half sine
DIM
A
MAX
.116
.089
.008
.02
MAX
2.95
2.25
.20
NOTE
1.98
1.70
.05
B
C
D
E
---
.51
.035
.065
.205
.160
.100
.055
.096
.224
.180
.112
.89
1.40
2.45
5.69
4.57
2.84
F
1.65
5.21
4.06
2.57
G
H
J
VF
.975V
1.35V
1.70V
IFM = 1.0A;
TJ = 25qC*
SUGGESTED SOLDER
PAD LAYOUT
IR
5PA
TJ = 25qC
0.090”
100PA TJ = 100qC
Maximum Reverse
Recovery Time
ES1A-D
0.085”
Trr
CJ
50ns
75ns
100ns
IF=0.5A, IR=1.0A,
Irr=0.25A
ES1G-K
ES1M
0.070”
Typical Junction
Capacitance
45pF
Measured at
1.0MHz, VR=4.0V
*Pulse test: Pulse width 200 Psec, Duty cycle 2%
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
www.mccsemi.com
Revision: C
2013/01/01
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