Datasheet > ERJ8GEYJ113X

ERJ8GEYJ113X

更新时间： 2024-11-07 07:44:07

品牌	Logo	应用领域
松下 - PANASONIC		/
页数	文件大小	规格书
4页	308K
描述
Fixed Resistor, Metal Glaze/thick Film, 0.25W, 11000ohm, 200V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1206, CHIP

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ERJ8GEYJ113X 数据手册

Thick Film Chip Resistors

0201, 0402, 0603, 0805, 1206,

1210, 1812, 2010, 2512

Type: ERJ 1G, 2G, 3G, 6G, 8G, 14,

12, 12Z, 1T

n Features

l Small size and lightweight

l High reliability

Metal glaze thick film resistive element and three layers of electrodes

l Compatible with placement machines

Taping and bulk case packaging available

l Suitable for both reflow and flow soldering

l Approved under the ISO 9001 system

Approved under the QS-9000 system

l Reference Standards

IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A

n Explanation of Part Numbers

Packaging Specifications

Packaging

Code

Punched (Paper) Taping

(Only 3G, 6G, 8G type)

Embossed Taping

(Only 14, 12, 12Z, 1T type)

Bulk case

(Only 2G, 3G, 6G type)

Punched (Paper) Taping

2 mm pitch, 10000 pcs.

(Only 2G, 3G type)

Punched (Paper) Taping

2 mm pitch, 20000 pcs.

(Only 2G type)

Punched (Paper) Taping

2 mm pitch, 15000 pcs.

(Only 1G type)

] When partly omitted, all the rest P/N factors should be moved up respectively.

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.

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