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EMK11G2H-106.250MTR PDF预览

EMK11G2H-106.250MTR

更新时间: 2024-11-05 14:42:03
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日蚀 - ECLIPTEK /
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6页 197K
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EMK11G2H-106.250MTR 数据手册

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RoHS  
Pb  
EMK11G2H-106.250M TR  
EMK11 G 2 H -106.250M TR  
Series  
Packaging Options  
RoHS Compliant (Pb-free) 4 Pad 5mm x 7mm SMD  
1.8Vdc LVCMOS MEMS Oscillator  
Tape & Reel  
Nominal Frequency  
Frequency Tolerance/Stability  
±100ppm Maximum over -40°C to +85°C  
106.250MHz  
Output Control Function  
Tri-State (Disabled Output: High Impedance)  
Duty Cycle  
50 ±5(%)  
ELECTRICAL SPECIFICATIONS  
Nominal Frequency  
106.250MHz  
Frequency Tolerance/Stability  
±100ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C,  
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,  
First Year Aging at 25°C, 260°C Reflow, Shock, and Vibration)  
Aging at 25°C  
±1ppm Maximum First Year  
Operating Temperature Range  
Supply Voltage  
-40°C to +85°C  
1.8Vdc ±5%  
Input Current  
18mA Maximum  
Output Voltage Logic High (Voh)  
Output Voltage Logic Low (Vol)  
Rise/Fall Time  
90% of Vdd Minimum (IOH=-8mA)  
10% of Vdd Maximum (IOL=+8mA)  
2nSec Maximum (Measured from 20% to 80% of waveform)  
50 ±5(%) (Measured at 50% of waveform)  
15pF Maximum  
Duty Cycle  
Load Drive Capability  
Output Logic Type  
CMOS  
Output Control Function  
Output Control Input Voltage  
Peak to Peak Jitter (tPK)  
Start Up Time  
Tri-State (Disabled Output: High Impedance)  
+0.7Vdd Minimum or No Connect to Enable Output, +0.3Vdd Maximum to Disable Output  
250pSec Maximum, 100pSec Typical  
50mSec Maximum  
Storage Temperature Range  
-55°C to +125°C  
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS  
ESD Susceptibility  
MIL-STD-883, Method 3015, Class 2, HBM 2000V  
Flammability  
UL94-V0  
Mechanical Shock  
Moisture Resistance  
Moisture Sensitivity Level  
Resistance to Soldering Heat  
Resistance to Solvents  
Solderability  
MIL-STD-883, Method 2002, Condition G, 30,000G  
MIL-STD-883, Method 1004  
J-STD-020, MSL 1  
MIL-STD-202, Method 210, Condition K  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only)  
MIL-STD-883, Method 1010, Condition B  
MIL-STD-883, Method 1011, Condition B  
MIL-STD-883, Method 2007, Condition A, 20G  
Temperature Cycling  
Thermal Shock  
Vibration  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 1 of 6  

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