是否Rohs认证: | 不符合 | 生命周期: | Contact Manufacturer |
零件包装代码: | TSSOP | 包装说明: | TSSOP, TSSOP24,.25 |
针数: | 24 | Reach Compliance Code: | unknown |
风险等级: | 5.88 | 位大小: | 8 |
JESD-30 代码: | R-PDSO-G24 | JESD-609代码: | e0 |
端子数量: | 24 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TSSOP24,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
电源: | 3 V | 认证状态: | Not Qualified |
RAM(字节): | 512 | ROM(单词): | 4096 |
ROM可编程性: | FLASH | 速度: | 10 MHz |
子类别: | Microcontrollers | 最大压摆率: | 80 mA |
标称供电电压: | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 0.635 mm | 端子位置: | DUAL |
Base Number Matches: | 1 |
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