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EM63A165TS-6G PDF预览

EM63A165TS-6G

更新时间: 2024-01-26 06:56:48
品牌 Logo 应用领域
钰创 - ETRON 内存集成电路光电二极管动态存储器
页数 文件大小 规格书
73页 1390K
描述
16Mega x 16 Synchronous DRAM (SDRAM)

EM63A165TS-6G 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
包装说明:TSOP2,Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.24
风险等级:5.66访问模式:FOUR BANK PAGE BURST
最长访问时间:5 ns其他特性:AUTO/SELF REFRESH
JESD-30 代码:R-PDSO-G54长度:22.22 mm
内存密度:268435456 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:16功能数量:1
端口数量:1端子数量:54
字数:16777216 words字数代码:16000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:16MX16
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:1.2 mm
自我刷新:YES最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.16 mm
Base Number Matches:1

EM63A165TS-6G 数据手册

 浏览型号EM63A165TS-6G的Datasheet PDF文件第3页浏览型号EM63A165TS-6G的Datasheet PDF文件第4页浏览型号EM63A165TS-6G的Datasheet PDF文件第5页浏览型号EM63A165TS-6G的Datasheet PDF文件第7页浏览型号EM63A165TS-6G的Datasheet PDF文件第8页浏览型号EM63A165TS-6G的Datasheet PDF文件第9页 
EtronTech  
EM63A165  
Commands  
1
BankActivate  
(RAS# = "L", CAS# = "H", WE# = "H", BAs = Bank, A0-A12 = Row Address)  
The BankActivate command activates the idle bank designated by the BA0,1 signals. By  
latching the row address on A0 to A12 at the time of this command, the selected row access is  
initiated. The read or write operation in the same bank can occur after a time delay of tRCD(min.) from  
the time of bank activation. A subsequent BankActivate command to a different row in the same bank  
can only be issued after the previous active row has been precharged (refer to the following figure).  
The minimum time interval between successive BankActivate commands to the same bank is defined  
by tRC(min.). The SDRAM has four internal banks on the same chip and shares part of the internal  
circuitry to reduce chip area; therefore it restricts the back-to-back activation of the four banks.  
tRRD(min.) specifies the minimum time required between activating different banks. After this  
command is used, the Write command and the Block Write command perform the no mask write  
operation.  
T0  
T1  
T2  
T3  
Tn+3  
Tn+4  
Tn+5  
Tn+6  
CLK  
..............  
..............  
Bank A  
Row Addr.  
Bank A  
Col Addr.  
Bank B  
Row Addr.  
Bank A  
Row Addr.  
ADDRESS  
RAS# - RAS# delay time (tRRD)  
NOP  
RAS# - CAS# delay (tRCD)  
NOP  
R/W A with  
AutoPrecharge  
Bank A  
Activate  
Bank B  
Activate  
Bank A  
Activate  
..............  
COMMAND  
NOP  
NOP  
RAS# Cycle time (tRC  
)
AutoPrecharge  
Begin  
: "H" or "L"  
BankActivate Command Cycle  
(Burst Length = n, CAS# Latency = 3)  
2
BankPrecharge command  
(RAS# = "L", CAS# = "H", WE# = "L", BAs = Bank, A10 = "L", A0-A9, A11 and A12 = Don't care)  
The BankPrecharge command precharges the bank disignated by BA signal. The precharged  
bank is switched from the active state to the idle state. This command can be asserted anytime after  
tRAS(min.) is satisfied from the BankActivate command in the desired bank. The maximum time any  
bank can be active is specified by tRAS(max.). Therefore, the precharge function must be performed in  
any active bank within tRAS(max.). At the end of precharge, the precharged bank is still in the idle state  
and is ready to be activated again.  
3
4
PrechargeAll command  
(RAS# = "L", CAS# = "H", WE# = "L", BAs = Don’t care, A10 = "H", A0-A9, A11 and A12 = Don't care)  
The PrechargeAll command precharges all banks simultaneously and can be issued even if all  
banks are not in the active state. All banks are then switched to the idle state.  
Read command  
(RAS# = "H", CAS# = "L", WE# = "H", BAs = Bank, A10 = "L", A0-A8 = Column Address)  
The Read command is used to read a burst of data on consecutive clock cycles from an active  
row in an active bank. The bank must be active for at least tRCD(min.) before the Read command is  
issued. During read bursts, the valid data-out element from the starting column address will be  
available following the CAS# latency after the issue of the Read command. Each subsequent data-out  
element will be valid by the next positive clock edge (refer to the following figure). The DQs go into  
high-impedance at the end of the burst unless other command is initiated. The burst length, burst  
sequence, and CAS# latency are determined by the mode register, which is already programmed. A  
full-page burst will continue until terminated (at the end of the page it will wrap to column 0 and  
continue).  
6
Rev 1.1 Apr. 2007  

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