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ELJRF1M0DZF2 PDF预览

ELJRF1M0DZF2

更新时间: 2024-11-10 00:36:23
品牌 Logo 应用领域
松下 - PANASONIC /
页数 文件大小 规格书
18页 478K
描述
Inductors Chip Inductors

ELJRF1M0DZF2 数据手册

 浏览型号ELJRF1M0DZF2的Datasheet PDF文件第2页浏览型号ELJRF1M0DZF2的Datasheet PDF文件第3页浏览型号ELJRF1M0DZF2的Datasheet PDF文件第4页浏览型号ELJRF1M0DZF2的Datasheet PDF文件第5页浏览型号ELJRF1M0DZF2的Datasheet PDF文件第6页浏览型号ELJRF1M0DZF2的Datasheet PDF文件第7页 
Inductors  
Chip Inductors  
2ꢎꢈꢎꢊ  
8uvƒꢀDqˆp‡‚ꢁ†  
ꢀꢁꢂꢃꢁꢄꢅꢀ8uvƒ  
ꢆꢇꢈꢁꢅ  
Aꢂꢀ@ꢂ  
4  
3  
!##5  
(0402)  
!ꢓ#6  
(0603)  
9ꢂꢀ8ꢂꢀ6ꢂꢀ7  
(ꢟ  
+  
-  
.  
7#!7  
(0805)  
757#  
(1008)  
8775  
(1210)  
9587  
(1812)  
(ꢒꢊꢐ)ꢒꢌꢊꢋꢐꢎꢊꢋꢐ)ꢃꢂꢁꢐ)ꢒꢌꢊꢋꢐꢍꢇꢈꢁꢐ'ꢘꢃꢈꢐꢃꢊꢋꢌ'ꢍꢒꢂꢄꢐꢛꢒꢂꢐꢎꢌꢍꢒꢜꢎꢍꢃ'ꢐꢎꢊꢋꢐꢘꢃꢕꢘ&ꢋꢁꢊꢄꢃꢍꢇꢐꢜꢒꢌꢊꢍꢃꢊꢕ  
ꢉꢊꢋꢌꢄꢍꢂꢃꢎꢏꢐꢑꢂꢒꢈꢁꢂꢍꢇꢐꢅꢐꢑꢎꢍꢁꢊꢍꢄꢐꢓꢐꢔꢈꢁꢊꢋꢃꢊꢕꢖ  
Features  
ꢗꢃꢕꢘꢐꢙ  
ꢚꢒꢒꢋꢐꢛꢒꢂꢐꢜꢒꢌꢊꢍꢃꢊꢕ  
ꢝꢃꢋꢁꢐꢎꢞꢎꢃꢏꢎ ꢃꢏꢃꢍꢇꢐꢂꢎꢊꢕꢁꢐꢔ!"# ꢊꢗꢐꢍꢒꢐ!### /ꢗꢖ  
ꢀꢍꢎ ꢏꢁꢐ%ꢐ&ꢞꢎꢏꢌꢁꢐꢃꢊꢐꢎꢊꢇꢐꢜꢒꢌꢊꢍꢃꢊꢕꢐꢋꢃꢂꢁ'ꢍꢃꢒꢊꢔ(ꢒꢊꢐ)ꢃꢊꢋꢃꢊꢕꢐꢍꢇꢈꢁꢖ  
Recommended Applications  
ꢑꢒꢂꢍꢎ ꢏꢁꢐꢍꢁꢏꢁꢈꢘꢒꢊꢁꢄ*ꢐꢝꢃꢂꢁꢏꢁꢄꢄꢐ+ꢒꢜꢜꢌꢊꢃ'ꢎꢍꢃꢒꢊꢐꢁ,ꢌꢃꢈꢜꢁꢊꢍꢐꢔꢝ&%-(*ꢐ.ꢆꢖ*  
ꢑꢟ-*ꢐ+ꢎꢜ'ꢒꢂꢋꢁꢂ*ꢐꢟꢀ+*ꢐ0ꢎꢂꢃꢒꢌꢄꢐꢜꢒꢋꢌꢏꢁ*ꢐꢗꢉ+*ꢐꢆ0*ꢐ0ꢆ1*ꢐꢑ+ꢐꢈꢁꢂꢃꢈꢘꢁꢂꢎꢏꢄ"  
ꢀꢁExplanation of Part Numbers  
Example of Part Number Build:  
2
* Q Min. - Please check the each specification  
** SRF (Self-Resonant Frequency)  
1
3
4
5
7
8
6
9
10  
11  
E
L
J
F
A
2
2
1
J
F
Packaging  
Tolerance  
Optional***  
Nominal Inductance  
Product Code  
Type  
Value  
Code  
Value  
Code  
Tape & Reel  
F
Z:  
D:  
E:  
G:  
A:  
J:  
*
*
*
*
*
*
*
*
0.2  
0.3  
0.5  
2
nH  
nH  
nH  
%
2N2 --> 2.2  
22N --> 22  
nH  
nH  
Laser-Cut  
Wire Wound Types  
R22 --> 0.22 uH  
2R2 --> 2.2  
220 --> 22  
uH  
uH  
3
%
Non Magnetic Core  
NonMagneticCore(HighQ)  
5
%
221 --> 220 uH  
102 --> 1000 uH  
K:  
M:  
10  
20  
%
General Use  
Magnetic Shield  
High Current  
%
***Note: Part Number position #11 is an optional factory designation.  
High Current, very low DCR  
Rev. 10/04  
Design and specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.  
Whenever a doubt about safety arises from this product, please contact us immediately for technical consultation.  

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