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EK13 PDF预览

EK13

更新时间: 2024-10-29 03:34:03
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APEX 二极管
页数 文件大小 规格书
2页 167K
描述
EVALUATION KIT FOR PA241DF

EK13 数据手册

 浏览型号EK13的Datasheet PDF文件第2页 
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INTRODUCTION  
ASSEMBLY  
Fast and easy breadboarding of circuits using the PA241DF  
IS possible with the EK13 evaluation kit. The amplifier may  
be surface mounted directly to the PC board. The PA241DF  
is soldered to a 2-square inch area of foil on the PC board for  
heat sinking. This foil heat sink is connected to–Vs. Connec-  
tions are provided for required power supply bypassing, phase  
compensation components, and a current limit resistor. A large  
area for component mounting provides flexibility and makes a  
multitude of circuit configurations possible.  
The PA241DF is a surface mount device and should be  
assembled to the EVAL15 PC board using surface mount  
processes. Solder paste may be dispensed or screen-printed  
on the DUT pads. The heat tab on the back of the PA241DF  
provides maximum heat dissipation capabilities when soldered  
to the PCB metalization that runs under the DUT on the DUT  
side of the board. Solder should be applied here also. For  
prototype purposes, the tab can be thermally connected to the  
PCB metalization using thermal grease.  
The PA241DF and HS24 should be reflowed to the PCB  
using a solder reflow furnace. If this is not available, a heat  
plate capable of solder reflow temperatures may be used. or,  
though time consuming, the leads may be soldered individually  
to the PCB with a soldering iron. In this case the use of thermal  
grease under the heat tab is recommended instead of solder  
for the thermal connection.  
PARTS LIST  
Part #  
Description  
Quantity  
EVAL15  
OX7R105KWN  
HS24  
PC Board  
1µF Ceramic Capacitor  
Heatsink  
1
1
1
High voltages will be present. Use caution in  
handling and probing when power is applied.  
CAUTION  
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APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com  
1

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