EG1MGF
SINTERED GLASS JUNCTION
FAST SWITCHING PLASTIC RECTIFIER
VOLTAGE:1000V
CURRENT: 1.0A
A-405
FEATURE
High temperature metallurgically bonded construction
Sintered glass cavity free junction
Capability of meeting environmental standard of
MIL-S-19500
High temperature soldering guaranteed
350°C /10sec/0.375”lead length at 5 lbs tension
Operate at Ta =55°C with no thermal run away
Typical Ir<0.2µA
Low power loss, high efficient
MECHANICAL DATA
Terminal: Plated axial leads solderable per
MIL-STD 202E, method 208C
Case: Molded with UL-94 Class V-0 recognized Flame
Retardant Epoxy
Polarity: color band denotes cathode
Mounting position: any
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half wave, 60HZ, resistive or inductive load rating at 25°C, unless otherwise stated)
units
SYMBOL
EG1MGF
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Vrrm
Vrms
Vdc
1000
700
V
V
V
Maximum DC blocking Voltage
Maximum Average Forward Rectified
Current 3/8”lead length at Ta =55°C
Peak Forward Surge Current 8.3ms single
half sine-wave superimposed on rated load
Maximum Forward Voltage at rated Forward
Current and 25°C
Maximum full load reverse current full cycle
average at 55°C Ambient
1000
If(av)
Ifsm
Vf
1.0
30
A
A
V
1.7
50
Ir(av)
µ
A
10
100
75
µ
µ
nS
pF
A
A
Maximum DC Reverse Current
at rated DC blocking voltage
Maximum Reverse Recovery Time (Note 1)
Ta =25°C
Ta =150°C
Ir
Trr
Cj
Typical Junction Capacitance
(Note 2)
15
°C
/W
Typical Thermal Resistance
(Note 3)
R(ja)
60
Storage and Operating Temperature Range
Note:
Tstg, Tj
-65 to +175
°C
1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
2. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc
3. Thermal Resistance from Junction to Ambient at 3/8”lead length, P.C. Board Mounted
Rev.A1
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