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EBE21UE8ACUA-8E-E PDF预览

EBE21UE8ACUA-8E-E

更新时间: 2024-01-30 09:54:22
品牌 Logo 应用领域
尔必达 - ELPIDA 存储内存集成电路动态存储器双倍数据速率时钟
页数 文件大小 规格书
27页 262K
描述
2GB DDR2 SDRAM SO-DIMM

EBE21UE8ACUA-8E-E 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SODIMM包装说明:DIMM, DIMM200,24
针数:200Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.36
风险等级:5.84Is Samacsys:N
访问模式:DUAL BANK PAGE BURST最长访问时间:0.4 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):400 MHz
I/O 类型:COMMONJESD-30 代码:R-XZMA-N200
内存密度:17179869184 bit内存集成电路类型:DDR DRAM MODULE
内存宽度:64功能数量:1
端口数量:1端子数量:200
字数:268435456 words字数代码:256000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:组织:256MX64
输出特性:3-STATE封装主体材料:UNSPECIFIED
封装代码:DIMM封装等效代码:DIMM200,24
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.8 V
认证状态:Not Qualified刷新周期:8192
自我刷新:YES最大待机电流:0.16 A
子类别:DRAMs最大压摆率:3.04 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:NO
技术:CMOS温度等级:OTHER
端子形式:NO LEAD端子节距:0.6 mm
端子位置:ZIG-ZAG处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

EBE21UE8ACUA-8E-E 数据手册

 浏览型号EBE21UE8ACUA-8E-E的Datasheet PDF文件第21页浏览型号EBE21UE8ACUA-8E-E的Datasheet PDF文件第22页浏览型号EBE21UE8ACUA-8E-E的Datasheet PDF文件第23页浏览型号EBE21UE8ACUA-8E-E的Datasheet PDF文件第24页浏览型号EBE21UE8ACUA-8E-E的Datasheet PDF文件第25页浏览型号EBE21UE8ACUA-8E-E的Datasheet PDF文件第26页 
EBE21UE8ACUA  
The information in this document is subject to change without notice. Before using this document, confirm that this is the latest version.  
No part of this document may be copied or reproduced in any form or by any means without the prior  
written consent of Elpida Memory, Inc.  
Elpida Memory, Inc. does not assume any liability for infringement of any intellectual property rights  
(including but not limited to patents, copyrights, and circuit layout licenses) of Elpida Memory, Inc. or  
third parties by or arising from the use of the products or information listed in this document. No license,  
express, implied or otherwise, is granted under any patents, copyrights or other intellectual property  
rights of Elpida Memory, Inc. or others.  
Descriptions of circuits, software and other related information in this document are provided for  
illustrative purposes in semiconductor product operation and application examples. The incorporation of  
these circuits, software and information in the design of the customer's equipment shall be done under  
the full responsibility of the customer. Elpida Memory, Inc. assumes no responsibility for any losses  
incurred by customers or third parties arising from the use of these circuits, software and information.  
[Product applications]  
Be aware that this product is for use in typical electronic equipment for general-purpose applications.  
Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability.  
However, users are instructed to contact Elpida Memory's sales office before using the product in  
aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment,  
medical equipment for life support, or other such application in which especially high quality and  
reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury.  
[Product usage]  
Design your application so that the product is used within the ranges and conditions guaranteed by  
Elpida Memory, Inc., including the maximum ratings, operating supply voltage range, heat radiation  
characteristics, installation conditions and other related characteristics. Elpida Memory, Inc. bears no  
responsibility for failure or damage when the product is used beyond the guaranteed ranges and  
conditions. Even within the guaranteed ranges and conditions, consider normally foreseeable failure  
rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so  
that the equipment incorporating Elpida Memory, Inc. products does not cause bodily injury, fire or other  
consequential damage due to the operation of the Elpida Memory, Inc. product.  
[Usage environment]  
Usage in environments with special characteristics as listed below was not considered in the design.  
Accordingly, our company assumes no responsibility for loss of a customer or a third party when used in  
environments with the special characteristics listed below.  
Example:  
1) Usage in liquids, including water, oils, chemicals and organic solvents.  
2) Usage in exposure to direct sunlight or the outdoors, or in dusty places.  
3) Usage involving exposure to significant amounts of corrosive gas, including sea air, CL2, H2S, NH3,  
SO2, and NO .  
x
4) Usage in environments with static electricity, or strong electromagnetic waves or radiation.  
5) Usage in places where dew forms.  
6) Usage in environments with mechanical vibration, impact, or stress.  
7) Usage near heating elements, igniters, or flammable items.  
If you export the products or technology described in this document that are controlled by the Foreign  
Exchange and Foreign Trade Law of Japan, you must follow the necessary procedures in accordance  
with the relevant laws and regulations of Japan. Also, if you export products/technology controlled by  
U.S. export control regulations, or another country's export control laws or regulations, you must follow  
the necessary procedures in accordance with such laws or regulations.  
If these products/technology are sold, leased, or transferred to a third party, or a third party is granted  
license to use these products, that third party must be made aware that they are responsible for  
compliance with the relevant laws and regulations.  
M01E0706  
Data Sheet E1217E10 (Ver. 1.0)  
27  

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