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DVA16XP187

更新时间： 2024-11-07 06:54:55

品牌	Logo	应用领域
美国微芯 - MICROCHIP		/
页数	文件大小	规格书
18页	549K
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Processor Module and Device Adapter Specification

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DVA16XP187 数据手册

MPLAB^®ICE 2000

Processor Module and Device Adapter Specification

CONTENTS

2.0

MPLAB ICE 2000 SYSTEM

1.0 Introduction......................................................... 1

2.0 MPLAB ICE 2000 System................................... 1

3.0 Emulator-Related Issues .................................... 2

4.0 Processor Modules............................................. 2

5.0 Device Adapter Issues........................................ 4

6.0 Device Adapter Target Footprints ..................... 10

A brief overview of the different components of the

system is shown in the figure below. Each component

is discussed in the following subsections.

FIGURE 2-1: MPLAB^®ICE 2000

EMULATOR SYSTEM

Communications Cable

Emulator Pod

Processor Module

with Cable

1.0

INTRODUCTION

Power Supply

Cable

The processor modules for MPLAB ICE 2000 are

interchangeable personality modules that allow

MPLAB ICE 2000 to be reconfigured for emulation of

different PICmicro^®microcontrollers (MCUs). This

modularity allows the emulation of many different

devices with the addition of a processor module and

device adapter, which provides a very cost effective

multiprocessor emulation system.

Logic Probe

Connector

Device Adapter

Transition Socket

The device adapters for MPLAB ICE 2000 are inter-

changeable assemblies that allow the emulator system

to interface to a target application system. Device

adapters also have control logic that allows the target

application to provide a clock source and power to the

processor module. The device adapters support

PICmicro MCUs in DIP, SDIP and PLCC packages.

2.1

Host to Pod Cable

This is a standard parallel interface cable. MPLAB ICE

2000 is tested with a 6-foot cable. A longer cable may

work, but is not ensured. The cable connects to a par-

allel port on the PC. If a PC has a printer connected to

an LPT device, it is recommended that an additional

interface card be installed, rather than using a splitter

or an A/B switch.

Transition sockets, used along with a device adapter,

provide a method of accommodating all PICmicro MCU

packages, including SOIC, SSOP, PQFP and TQFP

packages.

2.2

Emulator Pod

The Emulator Pod contains emulator memory and

control logic. MPLAB ICE 2000 contains a main board

and an additional board for expanded trace memory

and complex control logic. There are no field service-

able parts in the pod. For more information on the pod,

see the MPLAB ICE 2000 on-line help file in MPLAB

IDE (Help>Topics) or the “MPLAB^®ICE 2000

In-Circuit Emulator User’s Guide” (DS51488).

The MPLAB ICE 2000 processor module is inserted

into the pod for operation.

2.3

Processor Module

The processor module contains the emulator chip, logic

and low-voltage circuitry. There are no field-serviceable

parts mounted on the printed circuit board housed

within the processor module enclosure.

DS51140M-page 1

12 3 4 5 6 7...18

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