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DTC114YE/D

更新时间： 2024-02-05 19:30:46
品牌 Logo 应用领域
其他 - ETC 晶体晶体管
页数 文件大小 规格书
8页 78K
描述
Bias Resistor Transistor

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DTC114YE/D 技术参数

是否Rohs认证： 符合生命周期：Obsolete
包装说明：IN-LINE, R-PSIP-T3针数：3
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8541.21.00.95风险等级：5.57
Is Samacsys：N其他特性：DIGITAL, BUILT-IN BIAS RESISTOR RATIO IS 4.7
最大集电极电流 (IC)：0.07 A集电极-发射极最大电压：50 V
配置：SINGLE WITH BUILT-IN RESISTOR最小直流电流增益 (hFE)：68
JESD-30 代码：R-PSIP-T3元件数量：1
端子数量：3封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：IN-LINE
峰值回流温度（摄氏度）：NOT SPECIFIED极性/信道类型：NPN
最大功率耗散 (Abs)：0.3 W认证状态：Not Qualified
子类别：BIP General Purpose Small Signal表面贴装：NO
端子形式：THROUGH-HOLE端子位置：SINGLE
处于峰值回流温度下的最长时间：NOT SPECIFIED晶体管应用：SWITCHING
晶体管元件材料：SILICONBase Number Matches：1

DTC114YE/D 数据手册

 浏览型号DTC114YE/D的Datasheet PDF文件第1页浏览型号DTC114YE/D的Datasheet PDF文件第2页浏览型号DTC114YE/D的Datasheet PDF文件第3页浏览型号DTC114YE/D的Datasheet PDF文件第5页浏览型号DTC114YE/D的Datasheet PDF文件第6页浏览型号DTC114YE/D的Datasheet PDF文件第7页 
DTC114YE  
MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS  
Surface mount board layout is a critical portion of the total  
design. The footprint for the semiconductor packages must  
be the correct size to insure proper solder connection  
interface between the board and the package. With the  
correct pad geometry, the packages will self align when  
subjected to a solder reflow process.  
0.5 min. (3x)  
TYPICAL  
SOLDERING PATTERN  
Unit: mm  
1.4  
SOT–416/SC–90 POWER DISSIPATION  
The power dissipation of the SOT–416/SC–90 is a  
function of the pad size. This can vary from the minimum  
pad size for soldering to the pad size given for maximum  
power dissipation. Power dissipation for a surface mount  
the equation for an ambient temperature T of 25°C, one can  
calculate the power dissipation of the device which in this  
case is 125 milliwatts.  
A
150°C – 25°C  
PD  
=
= 125 milliwatts  
device is determined by T  
, the maximum rated  
J(max)  
1000°C/W  
junction temperature of the die, R , the thermal resistance  
θJA  
from the device junction to ambient; and the operating  
The 1000°C/W assumes the use of the recommended  
footprint on a glass epoxy printed circuit board to achieve a  
power dissipation of 125 milliwatts. Another alternative  
would be to use a ceramic substrate or an aluminum core  
board such as Thermal Clad . Using a board material such  
as Thermal Clad, a higher power dissipation can be achieved  
using the same footprint.  
temperature, T . Using the values provided on the data  
A
sheet, P can be calculated as follows:  
D
T
J(max) – TA  
Rθ  
PD  
=
JA  
The values for the equation are found in the maximum  
ratings table on the data sheet. Substituting these values into  
SOLDERING PRECAUTIONS  
The melting temperature of solder is higher than the rated  
temperature of the device. When the entire device is heated  
to a high temperature, failure to complete soldering within  
a short time could result in device failure. Therefore, the  
following items should always be observed in order to  
minimize the thermal stress to which the devices are  
subjected.  
• The soldering temperature and time should not exceed  
260°C for more than 10 seconds.  
• When shifting from preheating to soldering, the maximum  
temperature gradient should be 5°C or less.  
• After soldering has been completed, the device should be  
allowed to cool naturally for at least three minutes.  
Gradual cooling should be used as the use of forced  
cooling will increase the temperature gradient and result  
in latent failure due to mechanical stress.  
• Always preheat the device.  
• The delta temperature between the preheat and soldering  
should be 100°C or less.*  
• Mechanical stress or shock should not be applied during  
cooling.  
• When preheating and soldering, the temperature of the  
leads and the case must not exceed the maximum  
temperature ratings as shown on the data sheet. When  
using infrared heating with the reflow soldering method,  
the difference should be a maximum of 10°C.  
* Soldering a device without preheating can cause  
excessive thermal shock and stress which can result in  
damage to the device.  
SOLDER STENCIL GUIDELINES  
Prior to placing surface mount components onto a printed  
circuit board, solder paste must be applied to the pads. A  
solder stencil is required to screen the optimum amount of  
solder paste onto the footprint. The stencil is made of brass  
or stainless steel with a typical thickness of 0.008 inches.  
The stencil opening size for the surface mounted package  
should be the same as the pad size on the printed circuit  
board, i.e., a 1:1 registration.  
http://onsemi.com  
4
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