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DT00311-H4A3-4F PDF预览

DT00311-H4A3-4F

更新时间: 2024-10-30 20:02:23
品牌 Logo 应用领域
富士康 - FOXCONN PC连接器
页数 文件大小 规格书
1页 42K
描述
D Subminiature Connector, 25 Contact(s), Male, 0.109 inch Pitch, Solder Terminal, Locking, Receptacle, LEAD FREE

DT00311-H4A3-4F 技术参数

生命周期:Active包装说明:LEAD FREE
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8536.69.40.30风险等级:5.69
其他特性:ROHS COMPLIANT主体宽度:0.489 inch
主体深度:0.236 inch主体长度:2.089 inch
主体/外壳类型:RECEPTACLE连接器类型:D SUBMINIATURE CONNECTOR
联系完成配合:GOLD FLASH联系完成终止:GOLD FLASH
触点性别:MALE触点材料:COPPER ALLOY
触点模式:STAGGERED触点电阻:25 m Ω
触点样式:RND PIN-SKTDIN 符合性:NO
介电耐压:1000VAC V空壳:NO
滤波功能:NOIEC 符合性:NO
绝缘电阻:5000000000 Ω绝缘体颜色:BLACK
绝缘体材料:THERMOPLASTICJESD-609代码:e4
MIL 符合性:NO插接触点节距:0.109 inch
混合触点:NO安装选项1:LOCKING
安装方式:STRAIGHT安装类型:BOARD AND PANEL
PCB行数:2装载的行数:2
最高工作温度:105 °C最低工作温度:-55 °C
选件:GENERAL PURPOSEPCB接触模式:STAGGERED
PCB触点行间距:2.8448 mm电镀厚度:FLASH inch
额定电流(信号):5 A参考标准:UL
可靠性:COMMERCIAL外壳材料:POLYETHYLENE
外壳尺寸:3/B子类别:D Type Connectors
端子长度:0.125 inch端子节距:2.7686 mm
端接类型:SOLDER触点总数:25
UL 易燃性代码:94V-0Base Number Matches:1

DT00311-H4A3-4F 数据手册

  
SPECIFICATIONS  
D-SUB Connector  
DT Series  
Mechanical  
Contact Retention Force: 0.91kg (2.00Lb) min.  
Durability: 500 Cycles  
Straight Angle Type, T/H  
2.77mm [.109"] Pitch  
25 Pos.  
Electrical  
Current Rating: 5A  
Contact Resistance:25mW max.  
Dielectric Withstanding Voltage: 1000V AC/1min min.  
Insulation Resistance: 5000MW min.  
Physical  
Housing: Thermoplastic, UL 94V-0 rated in Black Color  
Contact: Copper alloy  
Plating: See “ORDERING INFORMATION”  
Operating Temperature: -55to +105℃  
Recommended Thickness of PCB: 1.57[.062]  
DRAWING  
ORDERING INFORMATION  
PRODUCT NO.: DT 0 0 3 1 1 - H4A3 - 4F  
Lead Free Part Number  
D-sub Series  
Body Type  
0=Straight Angle PCB Mount  
Extension Code  
Termnation Type  
0=Male  
Contact Area Plating  
1=Gold Flash  
NO. of Pos.  
3= 25 Pos.  
Body Length  
1=5.99 mm  
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.  

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