DSR0.3A - DSR0.3M
SURFACE MOUNT RECTIFIER DIODES
VOLTAGE RANGE: 50 - 1000V
CURRENT: 0.3 A
Features
Low profile space
Ideal for automated placement
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Glass passivated chip junctions
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature solder:ing
260℃/10 seconds at terminals
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B
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C
E
SOD-123FL
Dim Min Max
Typ
3.58 3.72 3.65
2.72 2.78 2.75
1.77 1.83 1.80
1.02 1.08 1.05
0.097 1.03 1.00
0.13 0.17 0.15
0.53 0.57 0.55
Mechanical Data
A
B
C
D
E
H
L
: JEDEC SOD-123FL molded
Case
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D
plastic body over passivated chip
H
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Terminals
: Plated axial leads,
L
Method 2026
solderable per MIL-STD-750,
Polarity
: Color band denotes cathode end
All Dimensions in mm
E
Mounting Position
: Any
Weight
:0.0007 ounce, 0.02 grams
A
Maximum Ratings and Electrical Characteristics
TA = 25ꢀC unless otherwise specified
For capacitive load, derate current by 20%.
Single phase, half wave, 60Hz, resistive or inductive load.
DSR
0.3A
DSR
0.3B
DSR
0.3D
DSR
0.3G
DSR
0.3J
DSR
0.3K
DSR
0.3M
Characteristic
Unit
Symbol
Maximum repetitive peak reverse voltage
VOLTS
1000
50
V
100
200
400
600
800
RRM
Maximum RMS voltage
VOLTS
VOLTS
70
140
200
280
400
420
600
560
800
700
35
50
VRMS
Maximum DC blocking voltage
VDC
100
1000
Maximum average forward rectified current
at TA=65 C (NOTE 1)
I(AV)
0.3
Amp
Peak forward surge current
IFSM
15.0
1.1
8.3ms single half sine-wave superimposed on
Amps
Volts
rated load (JEDEC Method)
TL=25 C
VF
IR
Maximum instantaneous forward voltage at 0.3A
Maximum DC reverse current
at rated DC blocking voltage
TA=25 C
5.0
50.0
µ
A
TA=100 C
Typical junction capacitance (NOTE 2)
CJ
pF
K/W
C
4
Typical thermal resistance (NOTE 3)
RθJA
220
,
Operating junction and storage temperature range
TJ TSTG
-55 to +150
Note1: Mounted on FR-4 P.C.B. With 0.9x1.5 mm copper pad areas (≈35 μm thick)
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