DSR0.5A - DSR0.5M
SURFACE MOUNT RECTIFIER DIODES
VOLTAGE RANGE: 50 - 1000V
CURRENT: 0.5A
Features
Low profile space
!
!
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Ideal for automated placement
Glass passivated chip junctions
Low forward voltage drop
Low leakage current
High forward surge capability
B
!
High temperature solder:ing
260℃/10 seconds at terminals
C
E
SOD-123FL
Dim Min Max
Typ
3.58 3.72 3.65
2.72 2.78 2.75
1.77 1.83 1.80
1.02 1.08 1.05
0.097 1.03 1.00
0.13 0.17 0.15
0.53 0.57 0.55
Mechanical Data
A
B
C
D
E
H
L
: JEDEC SOD-123FL molded
plastic body over passivated chip
Case
!
D
H
!
!
Terminals
solderable per MIL-STD-750,
: Plated axial leads,
L
Method 2026
Polarity
: Color band denotes cathode end
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All Dimensions in mm
Mounting Position
E
: Any
Weight
:0.0007 ounce, 0.02 grams
A
Maximum Ratings and Electrical Characteristics
TA = 25ꢀC unless otherwise specified
For capacitive load, derate current by 20%.
Single phase, half wave, 60Hz, resistive or inductive load.
DSR
0.5A
DSR
0.5B
DSR
0.5D
DSR
0.5G
DSR
0.5J
DSR
0.5K
DSR
Unit
0.5M
Symbol
Characteristic
Volts
1000
Maximum repetitive peak reverse voltage
Maximum RMS voltage
100
70
200
140
200
400
280
400
600
420
600
800
560
800
50
35
50
VRRM
VRMS
VDC
700
Volts
100
1000
Volts
Maximum DC blocking voltage
Maximum average forward rectified current
I(AV)
0.5
Amp
at TA=65 C (NOTE 1)
Peak forward surge current
IFSM
15.0
1.1
8.3ms single half sine-wave superimposed on
Amps
Volts
rated load (JEDEC Method)
TL=25 C
VF
IR
Maximum instantaneous forward voltage at 0.5A
Maximum DC reverse current
at rated DC blocking voltage
TA=25 C
5.0
50.0
µ
A
TA=100 C
Typical junction capacitance (NOTE 2)
Typical thermal resistance (NOTE 3)
CJ
pF
4
K/W
RθJA
220
Operating junction and storage temperature range
C
TJ,TSTG
-55 to +150
μm thick)
Note1: Mounted on FR-4 P.C.B. With 0.9x1.5 mm copper pad areas (
≈35
1 of 2
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