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DS8024-RRX+T&R PDF预览

DS8024-RRX+T&R

更新时间: 2024-01-03 00:29:56
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
15页 304K
描述
Microprocessor Circuit, CMOS, PDSO28, SOP-28

DS8024-RRX+T&R 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SOP,Reach Compliance Code:compliant
HTS代码:8542.31.00.01Factory Lead Time:6 weeks
风险等级:5.6JESD-30 代码:R-PDSO-G28
长度:17.9 mm端子数量:28
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
座面最大高度:2.65 mm最大供电电压:6 V
最小供电电压:2.7 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
宽度:7.5 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT
Base Number Matches:1

DS8024-RRX+T&R 数据手册

 浏览型号DS8024-RRX+T&R的Datasheet PDF文件第5页浏览型号DS8024-RRX+T&R的Datasheet PDF文件第6页浏览型号DS8024-RRX+T&R的Datasheet PDF文件第7页浏览型号DS8024-RRX+T&R的Datasheet PDF文件第9页浏览型号DS8024-RRX+T&R的Datasheet PDF文件第10页浏览型号DS8024-RRX+T&R的Datasheet PDF文件第11页 
Smart Card Interface  
The DS8024 card interface remains inactive no matter  
I/O Transceivers  
the levels on the command lines until duration t after  
W
The three data lines I/O, AUX1, and AUX2 are identical.  
This section describes the characteristics of I/O and  
I/OIN but also applies to AUX1, AUX1IN, AUX2, and  
AUX2IN.  
V
has reached a level higher than V  
+ V  
.
DD  
When V  
TH2  
HYS2  
falls below V  
, the DS8024 executes a  
DD  
TH2  
card deactivation sequence if its card interface is  
active.  
I/O and I/OIN are pulled high with an 11kresistor (I/O  
Clock Circuitry  
2
to V  
and I/OIN to V ) in the inactive state. The first  
CC DD  
side of the transceiver to receive a falling edge  
becomes the master. When the master is decided, the  
opposite side switches to slave mode, ignoring subse-  
quent edges until the master releases. After a time delay  
The clock signal from the DS8024 to the smart card  
(CLK) is generated from the clock input on XTAL1 or  
from a crystal operating at up to 20MHz connected  
between pins XTAL1 and XTAL2. The inputs CLKDIV1  
and CLKDIV2 determine the frequency of the CLK sig-  
t
, an n transistor on the slave side is turned on,  
thus transmitting the logic 0 present on the master side.  
D(EDGE)  
nal, which can be f  
, f  
/2, f  
/4, or f  
/8.  
XTAL  
XTAL XTAL  
XTAL  
Table 1 shows the relationship between CLKDIV1 and  
CLKDIV2 and the frequency of CLK.  
When the master side asserts a logic 1, a p transistor  
on the slave side is activated during the time delay t  
PU  
and then both sides return to their inactive (pulled up)  
states. This active pullup provides fast low-to-high tran-  
Do not change the state of pins CLKDIV1 and CLKDIV2  
simultaneously; a delay of 10ns minimum between  
changes is required. The minimum duration of any state  
of CLK is 8 periods of XTAL1.  
sitions. After the duration of t , the output voltage  
PU  
depends only on the internal pullup resistor and the  
load current. Current to and from the card I/O lines is  
limited internally to 15mA. The maximum frequency on  
these lines is 1MHz.  
The hardware in the DS8024 guarantees that the fre-  
quency change is synchronous. During a transition of  
the clock divider, no pulse is shorter than 45% of the  
smallest period, and the clock pulses before and after  
the instant of change have the correct width.  
Inactive Mode  
The DS8024 powers up with the card interface in the  
inactive mode. Minimal circuitry is active while waiting  
for the host to initiate a smart card session.  
To achieve a 45% to 55% duty factor on pin CLK when  
no crystal is present, the input signal on XTAL1 should  
have a 48% to 52% duty factor. Transition time on  
XTAL1 should be less than 5% of the period.  
• All card contacts are inactive (approximately 200Ω  
to GND).  
With a crystal, the duty factor on pin CLK may be 45%  
to 55% depending on the circuit layout and on the crys-  
tal characteristics and frequency.  
• Pins I/OIN, AUX1IN, and AUX2IN are in the high-  
impedance state (11kpullup resistor to V ).  
DD  
• Voltage generators are stopped.  
The DS8024 crystal oscillator runs when the device is  
powered up. If the crystal oscillator is used or the clock  
pulse on pin XTAL1 is permanent, the clock pulse is  
• XTAL oscillator is running (if included in the device).  
• Voltage supervisor is active.  
applied to the card at time t (see Figures 7 and 8). If  
4
• The internal oscillator is running at its low frequency.  
the signal applied to XTAL1 is controlled by the host  
microcontroller, the clock pulse is applied to the card  
when it is sent by the system microcontroller (after  
completion of the activation sequence).  
Activation Sequence  
After power-on and the reset delay, the host microcon-  
troller can monitor card presence with signals OFF and  
CMDVCC, as shown in Table 2.  
Table 1. Clocꢀ Frequency Selection  
CLKDIV1  
CLKDIV2  
f
Table 2. Card Presence Indication  
CLK  
0
0
1
1
0
1
1
0
f
f
f
/8  
/4  
/2  
XTAL  
XTAL  
XTAL  
OFF  
High  
Low  
CMDVCC  
High  
STATUS  
Card present.  
High  
Card not present.  
f
XTAL  
8
_______________________________________________________________________________________  

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