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DS3166N PDF预览

DS3166N

更新时间: 2024-02-08 21:50:57
品牌 Logo 应用领域
美信 - MAXIM ATM异步传输模式电信电信集成电路
页数 文件大小 规格书
386页 4134K
描述
Transceiver, 1-Func, PBGA676, 27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676

DS3166N 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676针数:676
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
风险等级:5.92应用程序:ATM;SDH;SONET
JESD-30 代码:S-PBGA-B676JESD-609代码:e0
长度:27 mm功能数量:1
端子数量:676最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):225
认证状态:Not Qualified座面最大高度:2.41 mm
标称供电电压:1.8 V表面贴装:YES
电信集成电路类型:ATM/SONET/SDH TRANSCEIVER温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:27 mm
Base Number Matches:1

DS3166N 数据手册

 浏览型号DS3166N的Datasheet PDF文件第2页浏览型号DS3166N的Datasheet PDF文件第3页浏览型号DS3166N的Datasheet PDF文件第4页浏览型号DS3166N的Datasheet PDF文件第5页浏览型号DS3166N的Datasheet PDF文件第6页浏览型号DS3166N的Datasheet PDF文件第7页 
DS3166/DS3168/DS31612  
6/8/12 ATM/Packet PHYs for  
DS3/E3/CC52  
www.maxim-ic.com  
FEATURES  
6 (DS3166), 8 (DS3168), or 12 (DS31612)  
ATM/Packet PHYs for DS3, E3, or Clear-Channel  
Up to 52Mbps  
On-Chip Per-Port BERTs for PRBS and Repetitive  
Pattern Generation, Detection, and Analysis  
Large Performance-Monitoring Counters for  
Accumulation Intervals of at Least 1 Second  
High-Speed Flexible Overhead Insertion/  
Extraction Ports for DS3, E3, and PLCP Framers  
Loopbacks Include Line, Diagnostic, Framer,  
Payload, and System Interface  
Each Port Independently Configurable  
Interfaces to LIUs or SONET/SDH Devices  
Universal PHYs Map ATM Cells and/or HDLC  
Packets into DS3 or E3 Data Streams  
6-, 8-, and 12-Port, Pin-Compatible Devices  
UTOPIA L2 or L3 or POS-PHY™ L2 or L3 or  
Ports can be Disabled to Reduce Power  
SPI-3 Interface with 8-, 16-, or 32-Bit Bus Width at Integrated Clock Rate Adapter can Generate the  
an Operating Frequency Up to 104MHz  
Ports Independently Configurable for Cell or  
Packet Traffic in POS-PHY/SPI-3 Bus Modes  
Direct, PLCP, DSS, and Clear-Channel Cell  
Mapping  
Direct and Clear-Channel Packet Mapping  
Ports Independently Configurable for DS3, E3 Full  
and Subrate, and Arbitrary Framing Protocols Up  
to 52Mbps  
Programmable (Internal) or External Subrate  
DS3/E3 Circuitry  
Required 44.736MHz for DS3, 34.368MHz for E3,  
and/or 51.84MHz for CC52 from a Single  
Reference  
Clock Rate Adapter Reference Clock Frequency  
can be 44.736, 34.368, 77.76, 51.84, or  
19.44MHz  
8/16-Bit Generic Microprocessor Interface  
Transparent Software Upgrade from Existing  
DS3161–DS3164 Single–Quad Port ATM/Packet  
PHY Devices  
Low-Power 1.8V Core, 3.3V I/O Operation (5V  
Tolerant I/O)  
DS3/E3/PLCP Alarm Generation and Detection  
Built-in HDLC Controllers with 256-Byte FIFOs for  
DS3 PMDL, G.751 Sn Bit, and G.832 NR/GC  
Bytes, and PLCP NR/GC Bytes  
Small 27mm2 (1mm pitch) TE-PBGA Packaging  
-40°C to +85°C Industrial Temperature Range  
IEEE 1149.1 JTAG Test Port  
FUNCTIONAL DIAGRAM  
ORDERING INFORMATION  
CHANNELS  
PART  
TEMP RANGE PIN-PACKAGE  
676 TE-PBGA  
DS3166  
6
0°C to +70°C  
(27mm2)  
676 TE-PBGA  
DS3166N  
DS3168  
6
8
-40°C to +85°C  
(27mm2)  
676 TE-PBGA  
0°C to +70°C  
POS-PHY  
OR  
(27mm2)  
CELL/  
PACKET  
DS3/E3  
FRAMER/  
DS3/E3 LINE  
INTERFACE  
676 TE-PBGA  
UTOPIA  
DS3168N  
DS31612  
DS31612N  
8
-40°C to +85°C  
(27mm2)  
PROCESSOR  
FORMATTER  
676 TE-PBGA  
DS3166  
12  
12  
0°C to +70°C  
(27mm2)  
DS3168  
DS31612  
676 TE-PBGA  
-40°C to +85°C  
(27mm2)  
POS-PHY and POS-PHY Level 3 are trademarks of PMC-Sierra, Inc.  
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device  
may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata.  
1
REV: 102105  

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