DS3166/DS3168/DS31612
6/8/12 ATM/Packet PHYs for
DS3/E3/CC52
www.maxim-ic.com
FEATURES
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6 (DS3166), 8 (DS3168), or 12 (DS31612)
ATM/Packet PHYs for DS3, E3, or Clear-Channel
Up to 52Mbps
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On-Chip Per-Port BERTs for PRBS and Repetitive
Pattern Generation, Detection, and Analysis
Large Performance-Monitoring Counters for
Accumulation Intervals of at Least 1 Second
High-Speed Flexible Overhead Insertion/
Extraction Ports for DS3, E3, and PLCP Framers
Loopbacks Include Line, Diagnostic, Framer,
Payload, and System Interface
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Each Port Independently Configurable
Interfaces to LIUs or SONET/SDH Devices
Universal PHYs Map ATM Cells and/or HDLC
Packets into DS3 or E3 Data Streams
6-, 8-, and 12-Port, Pin-Compatible Devices
UTOPIA L2 or L3 or POS-PHY™ L2 or L3 or
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Ports can be Disabled to Reduce Power
SPI-3 Interface with 8-, 16-, or 32-Bit Bus Width at ꢀ Integrated Clock Rate Adapter can Generate the
an Operating Frequency Up to 104MHz
Ports Independently Configurable for Cell or
Packet Traffic in POS-PHY/SPI-3 Bus Modes
Direct, PLCP, DSS, and Clear-Channel Cell
Mapping
Direct and Clear-Channel Packet Mapping
Ports Independently Configurable for DS3, E3 Full
and Subrate, and Arbitrary Framing Protocols Up
to 52Mbps
Programmable (Internal) or External Subrate
DS3/E3 Circuitry
Required 44.736MHz for DS3, 34.368MHz for E3,
and/or 51.84MHz for CC52 from a Single
Reference
Clock Rate Adapter Reference Clock Frequency
can be 44.736, 34.368, 77.76, 51.84, or
19.44MHz
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8/16-Bit Generic Microprocessor Interface
Transparent Software Upgrade from Existing
DS3161–DS3164 Single–Quad Port ATM/Packet
PHY Devices
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Low-Power 1.8V Core, 3.3V I/O Operation (5V
Tolerant I/O)
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DS3/E3/PLCP Alarm Generation and Detection
Built-in HDLC Controllers with 256-Byte FIFOs for
DS3 PMDL, G.751 Sn Bit, and G.832 NR/GC
Bytes, and PLCP NR/GC Bytes
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Small 27mm2 (1mm pitch) TE-PBGA Packaging
-40°C to +85°C Industrial Temperature Range
IEEE 1149.1 JTAG Test Port
FUNCTIONAL DIAGRAM
ORDERING INFORMATION
CHANNELS
PART
TEMP RANGE PIN-PACKAGE
676 TE-PBGA
DS3166
6
0°C to +70°C
(27mm2)
676 TE-PBGA
DS3166N
DS3168
6
8
-40°C to +85°C
(27mm2)
676 TE-PBGA
0°C to +70°C
POS-PHY
OR
(27mm2)
CELL/
PACKET
DS3/E3
FRAMER/
DS3/E3 LINE
INTERFACE
676 TE-PBGA
UTOPIA
DS3168N
DS31612
DS31612N
8
-40°C to +85°C
(27mm2)
PROCESSOR
FORMATTER
676 TE-PBGA
DS3166
12
12
0°C to +70°C
(27mm2)
DS3168
DS31612
676 TE-PBGA
-40°C to +85°C
(27mm2)
POS-PHY and POS-PHY Level 3 are trademarks of PMC-Sierra, Inc.
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata.
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REV: 102105