16 Megabit High Speed CMOS SRAM
DPS1MX16MKn3
SLCC Stack
DESCRIPTION:
The DPS1MX16MKn3 High Speed SRAM ‘’STACK’’ modules are a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded
packages. The module packs 16-Megabits of low-power CMOS
static RAM in an area as small as 0.549 in2, while maintaining a
total height as low as 0.269 inches.
The DPS1MX16MKn3 STACK modules contain four individual
512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,
making the modules suitable for commercial, industrial and
military applications.
Straight
Leaded
Stack
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
FEATURES:
·
Organizations Available:
1Meg x 16 or 2 Meg x 8
·
Access Times: 20*, 25, 30, 35, 45ns
·
Fully Static Operation
- No clock or refresh required
‘’J’’ Leaded
Stack
·
Single +5V Power Supply, ±10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
·
·
·
Low Data Retention Voltage:
Packages Available:
SLCC Stack
2.0V min.
·
Straight Leaded Stack
‘’J’’ Leaded Stack
Gullwing Leaded Stack
Gullwing
Leaded
Stack
Commercial and Industrial Grade only.
*
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
Address Inputs
Data Input/Output
Low Chip Enables
Write Enable
Output Enables
Power (+5V)
Ground
A0 - A18
I/O0 - I/O15
CE0 - CE3
WE
OE0, OE1
VDD
VSS
N.C.
No Connect
30A129-04
REV. E
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
1
This Material Copyrighted By Its Respective Manufacturer