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DPAM-23-14.0-S-8-2-A-TR

更新时间： 2024-10-29 18:33:15
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
1页 505K
描述
Board Connector

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DPAM-23-14.0-S-8-2-A-TR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：ActiveReach Compliance Code：compliant
Factory Lead Time：2 weeks风险等级：5.78
连接器类型：BOARD CONNECTOR联系完成配合：GOLD (30) OVER NICKEL (50)
联系完成终止：Matte Tin (Sn) - with Nickel (Ni) barrier触点材料：COPPER ALLOY
JESD-609代码：e3Base Number Matches：1

DPAM-23-14.0-S-8-2-A-TR 数据手册

  
F-211-1  
DPAM–23–07.0–S–8–2–A  
DPAF–23–03.0–S–8–2–A  
(2,16mm) .085"  
DPAM, DPAF SERIES  
®
HIGH DENSITY DIFFERENTIAL PAIR ARRAY  
DPAM Mates with:  
PAIRS  
PER ROW  
LEAD  
STYLE  
PLATING  
OPTION  
NO. OF  
ROWS  
SOLDER  
TYPE  
DPAF, RDPAF  
OPTION  
DPAM  
A
DPAF Mates with:  
DPAM  
Specify  
LEAD  
STYLE  
from  
–8  
=Eight  
Pair  
SPECIFICATIONS  
–K  
–2  
–S  
=(20,00mm) 0.80"  
DIA Polyimide  
film Pick &  
–04, –06  
= Lead-Free  
Tin Alloy  
=30µ" (0,76µm)  
Gold on contact area,  
Tin on solder tail  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?DPAM or  
www.samtec.com?DPAF  
Rows  
(–07.0 only)  
96.5% Sn/  
3% Ag/.5% Cu  
Solder Crimp  
chart  
Place Pad  
–08, –15, –23  
–3  
=Three  
Pair  
Rows  
(–07 only)  
(All lead styles)  
Insulator Material:  
Black LCP  
–TR  
=Tape & Reel  
Contact Material:  
Copper Alloy  
Perimeter  
Grounds (TYP)  
G1  
Plating:  
(2,54)  
.100  
–GP  
=Guide Post  
(–23 only &  
–07 only)  
Au over 50µ" (1,27µm) Ni  
Current Rating (2x3):  
2.9A @ 30°C Temperature Rise  
Operating Temp Range:  
-55°C to +125°C  
Contact Resistance:  
10.4mΩ max  
LEAD  
B
A
STYLE  
(6,66) .262  
(10,72) .422  
(13,66) .538  
–07.0  
–11.0  
–14.0  
(2,54)  
.100  
02 01 G2 03 04  
Signal Pairs (TYP)  
No. of positions x (2,16) .085 + (4,34) .171  
Working Voltage:  
300 VAC  
®
Staggered pitch DPAM/DPAF Rated @ 3dB Insertion Loss  
10mm Stack Height  
Differential Pair Signaling  
Performance data for other stack heights and complete  
test data available at www.samtec.com?DPAM,  
www.samtec.com?DPAF or contact sig@samtec.com  
Mated Cycles:  
100 Cycles  
NO OF  
ROWS  
(0,13)  
.005  
A
RoHS Compliant:  
B
7.0 GHz / 14.0 Gbps  
Ye s  
(24,59) .968  
(11,89) .468  
–8  
–3  
Lead-Free Solderable:  
Yes  
(1,27)  
.050  
DIA  
(2,16) .085  
(1,27)  
.050  
(1,08) .0425  
No. of positions x (2,16) .085 + (2,95) .116  
PAIRS  
PER ROW  
PLATING  
OPTION  
NO. OF  
ROWS  
SOLDER  
TYPE  
OPTION  
DPAF  
03.0  
A
–8  
Pair Rows  
–K  
=(20,00mm)  
0.80" DIA  
Polyimide  
film  
Pick &  
Place Pad  
=Eight  
–S  
–2  
=30µ" (0,76µm)  
Gold on contact area,  
Tin on solder tail  
= Lead-Free Tin Alloy  
96.5% Sn/ 3%Ag/  
.5% Cu  
–04, –06, –08,  
–15, –23  
–3  
Solder Crimp  
=Three  
Pair Rows  
No. of positions x (2,16) .085 + (4,34) .171  
Signal  
Pairs  
G1  
NO OF  
ROWS  
–TR  
=Tape  
& Reel  
A
(TYP)  
ALSO  
AVAILABLE  
(23,32)  
.918  
–8  
–3  
A
04  
USABLE PAIRS  
PER ARRAY*  
(10,62)  
.418  
(2,54)  
.100  
02  
01  
SIZE  
(1,52)  
.060  
Tin-Lead Solder Charge.  
Call Samtec.  
48 Pairs  
104 Pairs  
168 Pairs  
18 Pairs  
39 Pairs  
63 Pairs  
–08 x –8  
–15 x –8  
–23 x –8  
–08 x –3  
–15 x –3  
–23 x –3  
G2  
03  
(1,27) .050  
DPAF  
Perimeter Grounds (TYP)  
Solder crimped on tail  
DPAM  
LEAD  
STYLE  
MATED HEIGHT*  
–03.0  
10mm  
(6,45)  
.254  
(0,13)  
.005  
Note: Other Gold plating  
options available.  
Contact Samtec.  
–07.0  
–11.0  
–14.0  
14mm  
(2,16) .085  
(1,08) .0425  
(1,27)  
.050  
DIA  
17mm  
(1,27)  
.050  
Note: Some sizes, styles and  
options are non-standard,  
non-returnable.  
*Assumes first and last pair in  
each row are grounded  
*Processing conditions will  
affect mated height.  
No. of positions x (2,16) .085 + (2,95) .116  
WWW.SAMTEC.COM  
1

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