DPAD1
LOW LEAKAGE
PICO-AMP DUAL DIODE
Linear Systems replaces discontinued Siliconix DPAD1
The DPAD1 is a low leakage Monolithic Dual Pico-Amp Diode
FEATURES
The DPAD1 extremely low-leakage monolithic dual
DIRECT REPLACEMENT FOR SILICONIX DPAD1
HIGH ON ISOLATION
EXCELLENT CAPACITANCE MATCHING
ULTRALOW LEAKAGE
REVERSE BREAKDOWN VOLTAGE
REVERSE CAPACITANCE
ABSOLUTE MAXIMUM RATINGS
@ 25°C (unless otherwise noted)
diode provides a superior alternative to conventional
diode technology when reverse current (leakage) must
be minimized. In addition the monolithic dual
construction allows excellent capacitance matching per
diode. The DPAD1 features a leakage current of -1 pA
and is well suited for use in applications such as input
protection for operational amplifiers.
20fA
∆CR ≤ 0.2pF
≤ 1 pA
BVR ≥ ‐45V
Crss ≤ 0.8pF
DPAD1 Benefits:
Maximum Temperatures
Storage Temperature
Operating Junction Temperature
Maximum Power Dissipation
Continuous Power Dissipation
MAXIMUM CURRENT
Negligible Circuit Leakage Contribution
Circuit “Transparent” Except to Shunt
High-Frequency Spikes
‐65°C to +150°C
‐55°C to +135°C
Simplicity of Operation
500mW
50mA
DPAD1 Applications:
Forward Current (Note 1)
Op Amp Input Protection
Multiplexer Overvoltage Protection
DPAD1 ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)
SYMBOL
BVR
CHARACTERISTICS
Reverse Breakdown Voltage
Forward Voltage
MIN.
‐45
‐‐
‐‐
‐‐
‐‐
TYP.
‐‐
MAX.
‐‐
1.5
0.8
0.2
‐1
UNITS
V
V
pF
pF
pA
CONDITIONS
IR = ‐1µA
V
F
0.8
I = 1mA
Click To Buy
F
CrSS
|CR1‐CR2|
IR
Total Reverse Capacitance
Differential Capacitance (∆CR)
Maximum Reverse Leakage Current
‐‐
‐‐
‐‐
VR = ‐5V, f = 1MHz
VR1 = VR2 = ‐5V, f = 1MHz
VR = ‐ 20V
Notes:
1. Absolute maximum ratings are limiting values above which DPAD1 serviceability may be impaired.
TO-78 (Bottom View)
Available Packages:
DPAD1 in TO-78
DPAD1 available as bare die
Please contact Micross for full package and die dimensions
Micross Components Europe
Tel: +44 1603 788967
Email: chipcomponents@micross.com
Web: http://www.micross.com/distribution
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.
Micross Components Ltd, United Kingdom, Tel: +44 1603 788967, Fax: +44 1603788920, Email: baredie@micross.com Web: www.micross.com/distribution.aspx
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